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Study On Key Technologies For Paper Packing Laser Die-cutting

Posted on:2016-08-30Degree:MasterType:Thesis
Country:ChinaCandidate:Z C QinFull Text:PDF
GTID:2272330482956491Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
With the rapid development and continuous innovation of printing and packaging industry, the traditional die-cutting technology can hardly meet various, small amount and complex format paper die-cutting products’ needs due to its high die cutting plate production costs, complex production process,based on above, the paper packing laser die-cutting processing technology was proposed in this paper. Laser die-cutting technology is a kind of non-contact processing, rapidly and conveniently, especially suitable for different carton processing, it is significant to improve production efficiency and competitiveness for die-cutting processing enterprises.The paper packing laser die-cutting processing technology was studied from the theory of basic level firstly, including laser principle, different effects of the interaction between laser and material, the types and characteristics of the laser generator and the comparative analysis of laser die-cutting processing methods; Then the comparative analysis on structure of mirror mobile laser die-cutting and galvanometer scanning laser die-cutting is made, according to the characteristics of the laser die-cutting, the design of "L" shape lateral paper feed system was put forward; And then, systemic experimental studies on paper packing laser die-cutting was conducted, effects of laser power,die-cutting speed and packaging materials on the quality of the die-cutting were analyzed, the speed-power linear relationship of paper materials with different specifications was determined by experiments, laser die-cutting precision was measured and compared, with Leica high-power microscope,the effects of laser marking, laser lettering and laser die cutting were observed to verify whether laser die-cutting products can meet quality requirements.Finally, the paper studied optimization methods of burning issues,creasing production problems and scanning pattern distortion problems in laser die cutting process. For burning issues, in addition to introduction of the existing gas protection way, This paper proposed the method of "oppositedie-cutting, positive packaging" and the method of color paper material die cutting creatively, reducing the side effects of burning, and controlling the machining cost; the indentation method of laser die-cutting is widely replaced by making a series of small holes on paperboard, experiments in the paper analyzed how the density of those thin holes affect the strength and folding performance of paper packing, meanwhile, the indentation method of removing part of the material was tested, and satisfactory results were obtained; In the process analyzing scan pattern distortion of galvanometer laser die cutting,excepting the analysis of focus error, "pillow shaped" distortion and ‘’drum type’’ distortion, and a curved die cutting table structure was proposed for the focus error, consequently providing theoretical and experimental basis for further improving the quality of laser die cutting sequentially.
Keywords/Search Tags:laser die-cutting, lateral paper feed system, linear relationship, optimized analysis
PDF Full Text Request
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