Development And Experimental Study On Ultrasonic Vibration Assisted Multi-wire Saw

The single and polycrystalline silicon etc. optoelectronic wafer materials has been widely sliced by the multi-wire saw slicing process, but due to the equipment and processing complexity, the warp, edge collapse etc quality defects are often happened on the wafer surface, and cutting steel wire is easy to be broken during the wafer slicing process. Therefore it is urgent to develop a new slicing technique and equipment to improve the existing machining quality and efficiency, also the research on slicing process with new cutting technique is important significantly.Vibration assisted cutting technique is applied to cutting and grinding etc. machining process to improve the machining performance, the ultra-sonic vibration can be applied in wafer slicing process, because it has some advantages on the slicing process such as good heat dissipation, thin damaged layer, easy to make cutting chips flow out, and prevent wire break problems. It also can get the machining process efficiently with high surface quality for hard and brittle materials. This paper researched the principle of multi-wire saw cutting process,developed a new multi-wire saw equipped with ultrasonic vibration assisted device, through the experimental study, the new developed multi-wire saw can get the better slicing process for the optical glass then normal slicing process, a precision and efficiency slicing process for hard and brittle materials has been achieved by the assistance of supersonic vibration.The main work and achievements of this paper are as follows:1、Researched the working principle of multi-wire saw machine, free abrasive wire cutting and fixed abrasive wire cutting machining mechanism, and ultrasonic vibration machining technique are introduced.2、based on the analysis and design of processing system, guide system, cable system,feeding system, slurry supply system, retractable cable system, wire tension control system, a new multi-wire saw machine(ZGD100A)has been developed. The machine structure werespecifically analyzed through the use of SolidWorks software by establishing the three-dimensional model of the system, the strength of the main parts has been checked.3、According to the overall design of the ZGD100 A multi-wire saw machine, the design of the control system are completed, and the software for the multi motor speed synchronous control and wire tension control are developed.4、The assisted ultrasonic vibration system has been developed, by the design of ultrasonic transducer, ultrasonic horn, and ultrasonic power supply.5、Some slicing experiments by the ultrasonic vibration assisted multi-wire saw for hard and brittle materials have been carried out, and the results showed that, the ultrasonic vibration assisted sawing process is better than the ordinary sawing process under the same machining conditions, and the surface quality is improved obviously.