Optimal Design Of Thick Alumininm Wire Ultrasonic Welding Process Parameter

With the development of Micro-assembly technology, micro-electronic devices will play a more and more important role in the fields of astronautics and aeronautics, which makes more stringent requirements to quality ensuring and reliability of the assembling technology of micro-electronic devices. With the development of front end process such as High density mounting technology and Micro assembly technology, Wire bonding process is moving in Smaller pitch precision assembly direction, which is the most commonly used the Electrical interconnection technology in Microelectronics manufacturing industry.In 2012, Guilin Aerospace Electronics Co. Ltd began to prepare the production line of high grade solid relay. Up to now, this production line is still in the trial production stage, so some research on related micro assembly technology must be done until the new production line can works well by a dequate technical support. In order to meet the special requirements of the application of the second class of solid relay, this paper studied on parameter optimization design of ultrasonic wedge bonding process with combining finite element simulation analysis technology and DOE technology, which will apply to the bonding process of thick aluminum wire under the bonded production platform of Guilin Aerospace Electronics Co. Ltd.Firstly, the mechanism of Ultrasonic Wedge welding of thick aluminum wire is analyzed and studied in this paper, and the process factors were determined which lead to the strength of the thick aluminum wire bonding change. Using ABAQUS software to establish the nonlinear dynamic analysis model of the bonding of thick aluminum wire(the first bond), the stress and strain changes of coarse aluminum wire in the transverse vibration and longitudinal extrusion stage are studied by using the Standard nonlinear dynamic analysis module. In order to obtain the optimal parameter range of reliable bonding, the changes of stress and strain of the chip and the bonding point are compared and analyzed in different boundary conditions in this paper.Secondly, the range of the process parameters is obtained by the finite element simulation analysis. The intrinsic relationship between the main factors and the adjustable factor which affecting the bond strength is funded by robust parameter design method for the optimization of the large characteristic response variable. The optimal combination of process parameters for 500 ?m aluminum wire bonding was determined.Finally, the power components of the second class of solid relay are tested and verified, which Based on the combination of process parameters after optimization design. the bonded product is tested by several testing techniques such as inspection of the appearance quality, electrical parameters test, tensile test, corrosion test and destructive tensile test, the testing data shows that the quality of bonded products by optimizing the process parameters can not only meet the specification requirements of the national standard of China, but also make the bonding process ability of thick aluminum wire to be improved, the whole process of the bonding control is more stable and reliable.