High Overload Buffer Protection Of Light Circuit Module

During High overload penetration process, the onboard electronic devices need to withstand high overload, can be tens of thousands of g, which is very bad for the electronic device. Due to the high overload during impact, lightweight electronic device easily damaged problem occurs, carried out a research on high overload protection of electronic equipment under the environment, designed and verified an electronic device buffer protection structure.(1) since to high overload environment, by analyzing the factors influencing the destruction of electronic equipment onboard, it proposes a protective measures as reinforcement of internal combined with external buffer. Describes the internal high-strength housing and reasonable potting reinforcement methods; according to the unique material properties of aluminum and aluminum foam, an external buffer structure are proposed.(2) By quasi-static experiment for aluminum foam, aluminum and composite structures,analysis of the mechanical properties of the three materials, the results showed that: shell filled with aluminum foam composite structures can be the perfect combination of the advantages of both, greatly improve the energy absorption rate.(3) using the finite element simulation tool, design a finite element model of the air cannon impact test and the penetration of steel plate, observed the Penetrating Simulation under different circumstances. By observing aluminum foam padding aluminum to cushion the effects of different overload, penetration analysis during transfer of stress waves,acceleration curve before and after the buffer and buffer module energy absorption, draw relevant energy absorption law, provide theoretical guidance for the buffer to protect the structural design.(4) Designed air cannon buffer test system based on proven under high g shock environment, filled with aluminum foam shell composite structure can absorb high energy under the impact and reduce the overload peaks, the effective protection of electronicequipment, to verify the buffer Applicability structure.