A Design Of Deposition System For Magnetron Sputtering

For optical and dielectric function film preparation of ionization rate is low and target surface pollution problems, we design a magnetron sputtering deposition system, system including magnetron sputtering target device, the plasma source and anode cleaning device. The main conclusions are as follows:(1) In magnetron sputtering target device design, the use of magnetic liquid sealing instead of rubber bearing sealing, improves the tightness in the target device, ultimate vacuum can reach 10-6 Pa; Using rotating magnetic steel instead of fixed magnetic steel, the target material utilization from 30% to 60%, while avoiding the target device in advance when cleaning the pollution; Designed the drive end of the target device, completed the selection of motor, gear and bearing.(2) Plasma source is designed to improve the rate of depositional system from the problem of insufficient.Made cathode, choose 0.2 mm tungsten crucible as anode. Kirchhoff’s law is used to calculate the spiral pipe length and the cross-sectional area. Comparison of the plasma source of four kinds of power supply connection mode, select add supplementary control power supply spiral pipe at both ends and convenient adjust the way of electromagnetic field.(3)Design of anode cleaning devices to solve the problem of anode pollution of magnetron sputtering. Anode cleaning device consists of a rotating anode and cleaning device, designed a set of cleaning devices to work together more when the power supply connection. A line drawing cooling system solutions and to meet the cooling requirement of design of the system.Design a set of gas supply system, according to the requirement of design of the electromagnetic valve and the model of mass flowmeter.