Design And Analysis Of Key Parts Of Magnetron Sputtering Chamber With Negative Ion Source

In recent years,these industries,such as the nuclear physics,high energy physics,surface analysis,semiconductor device production and so on,has been developed rapidly due to the increasing maturity of the negative ion source sputtering technology,the negative ion source magnetron sputtering technology has become one of the most hot topic for the present mechanics,materials science,and at the same time,the low utilization of target material is taken as a big drawback of negative ion source magnetron sputtering technology,attention is paid by the more and more researchers,therefore,in this paper,the following researches have been conducted for the coating machine and utilization rate of target material of the negative ion source magnetron sputtering:Firstly,in this paper,the structure of the negative ion source magnetron sputtering chamber and its key components and parts has been designed by using the mechanical design theory,including the design of the negative ion source magnetron sputtering chamber,design of the magnetron sputtering target gun below the magnetron sputtering chamber,and the design of the work piece rest above the magnetron sputtering chamber.The shape,size and so on of the negative ion source magnetron sputtering chamber have been designed,and the flange layout design and the sealing design of the front door of negative ion source magnetron sputtering chamber have been conducted.The structure of magnetron sputtering target gun has been designed based on the principle of magnetic field design,and also the lead screw drive mechanism is designed,the continuous 60 mm adjustment of the magnetron sputtering target gun in the vertical direction has been realized,so that the target gun can be more accurately aligned with the workpiece rest,and the strength of drive system has been checked.The workpiece rotation mechanism and the telescopic mechanism in the vertical direction have been designed,the appropriate motor has been selected through the calculation,and the rotation of the driving and driven gear are driven by use of the motor,so that therotation of workpiece at 30r/min is realized.The design of the upward and downward telescopic movement of the workpiece rest is based on the lead screw drive mechanism,the 20 mm fine adjustment of the workpiece rest in the vertical direction has been realized,and the different parameters for the driving system of lifting screw have been checked,and thus the safety and stability of the driving mechanism have been guaranteed.In order to improve the utilization rate of the target material,according to the magnetic field theory,this is realized by optimizing the horizontal distribution range of the magnetic induction line on the surface of the target material.The finite element simulation for the magnetic field of the magnetron sputtering target gun is conducted by use of the ANSYS Workbench and Maxwell,and the optimization scheme for the magnetic field of the magnetron sputtering target gun is chosen,and it is compared with the data before the optimization,the utilization rate of target material after the optimization of magnetic field has been calculated,and the utilization rate of target material is increased by 18%.Finally,in order to measure the optimized utilization ratio of target material,the magnetron sputtering targets before and after the optimization are installed respectively,the coating film experiment has been conducted,and before the coating film experiment,the minimum starting voltage test of magnetron sputtering target gun has been conducted under the 1 Pa,5 Pa,10 Pa conditions of argon gas pressure respectively,the minimum starting voltage of magnetron sputtering target gun under the different pressure has been obtained,and then a coating film experiment is conducted.After the completion of coating film experiment,the lateral width of the target material surface sputtering circular ring in the two-times experiment is measured,it can be known that the lateral width of optimized sputtering circular ring is increased by 20.2%,the sputtering area is increased by 19.6%,and the depth in the etching area becomes more even,namely,the utilization ratio of target material is increased by more than 19.6%,the accuracy of the finite element simulation and theory has been verified.