Research On Preparation Technology For Lightweight Wood Substitute Packaging Material Based On The Modified Soy Protein

For the rational use of packaging and agricultural waste, the preparation of biomass materials becomes increasingly widespread in packaging industry hot spots. In this paper, obsolescence corrugated cardboard（OCC） and wheat straw are used for raw materials, soy protein isolate（SPI） is used for adhesives, a light wood packaging materials is prepared by hot-pressing process,a preliminary study is did on its industrial production technology and properties. Specific research contents and conclusions are as follows:1. Researched the effect of modification time, modifier species, modifier concentration, composite modified and other factors on the SPI viscosity and adhesive bonding strength. The results showed that: Suitable modified way is NaOH+Ca（OH）2, SDBS, urea three sections compound modified, each section 60 min, modified temperature 40 ℃.2. Researched the effect of compound species, compound concentration, complexing agent concentration and other factors on the SPI adhesive rheological properties and bonding strength. The results showed that: Adding complexing agent can promote the cross linking between compound and SPI complex. At moderate shear rate, the mechanical properties of samples and viscosity of the adhesives downward after increases overall with CMCNa or Na₂B₄O₇?10H2O increase.3. Researched the effect of modification methods adhesives on lightweight wood substitute packaging material properties. The results showed that: Stripe paper and straw powder as substrate, modified SPI as adhesive preparing samples. Under the conditions sizing 1:10,mat moisture content of 25%,pressing temperature 140 ℃,pressing pressure 2MPa,pressing time 15 min, Suitable substrate is paper and straw absolute dry mass ratio of 8: 2, composite modified SPI as adhesive.4. Researched the effect of the adhesive complex way, shape substrate, substrate ratio, and medium paving slab moisture content, pressing parameters and other factors on lightweight wood substitute packaging material properties. The results showed that: OCC fiber and straw powder as substrate, compound SPI as adhesive preparing samples. In savings time and cost factors, Suitable process conditions is OCC and straw absolute dry weight ratio of 7: 3, 1:10 sizing slab moisture content of 35% and a temperature 140 ℃, pressing pressure 2MPa, pressing time 30 min, best quality modified adhesive compound ratio of NaOH: Ca（OH）2: SDBS: urea: CMCNa: Na₂B₄O₇?10H2O: SPI: water = 0.01: 0.01: 0.1: 1.2: 0.2: 0.06: 1: 10.5. Researched the change and performance mechanism of SPI adhesives before and after modified or complex, samples before and after molding.6. Researched the selections and improvements of technology and equipment based on industrial production, to improve production efficiency and achieve continuous operation.This paper expands the scope of application of the packaging and agricultural waste, soy protein, the prepared lightweight wood packaging materials can meet the standards and applied to packaging to replace part of the wooden structure, while providing a theoretical basis for the actual production.