Blood Platelet Adhesion Behaviour Of Ti-Cu Films Synthesized By High-Power Pulsed Magnetron Sputtering

NO can be released from vascular endothelial cell effectively under the influence of Cu2+. The activation and aggregation of platelet can be inhibited by NO. Titanium has been researched and applied in the biomedical field for a long time because of good biocompatibility. The Ti-Cu films synthesized by high power pulsed magnetron sputtering (HPPMS) that has the characteristic of high ionization rate are dense. The release of copper was investigated by adjusting the parameters of HPPMS and controlling the copper content of films and the composition and structure of films. The investigation of Ti-Cu films was mainly concentrated in antibacterial fields..The research on the characteristics of deposition, composition structure, the blood compatibility of the Ti-Cu films deposited by HPPMS is less. So the Ti-Cu films deposited by HPPMS were put forward. The copper content, composition and structure of Ti-Cu films were adjusted by changing the process parameters of HPPMS. And the blood compatibility of films was investigated.Ti-Cu films were fabricated by high-power pulsed magnetron sputtering (HPPMS) with 800 and 600 V voltages employed on titanium targets embedded with 70 and 210 copper. The electrical characteristics and plasma of HPPMS were analyzed. The influence of voltage and target on the deposition rate, the composition, the structure and the surface morphology of the Ti-Cu films were investigated. The wettability and corrosion resistance of Ti-Cu films were tested. The experimental results indicated that the peak current and peak current sputtering ion increased with the increasing voltage. The discharge plasma of Ti, Ti+,Cu,Cu+, Ar+ were observed when Ti-Cu films were deposited. The number of plasma emission spectrum line and the intensity of spectrum increased with increasing target voltages, the intensity of plasma of Cu+ and Cu enhances with increasing Cu in the target. The deposition rate of Ti-Cu film increased with increasing voltage and Cu in the target. The deposition rate of Ti-Cu films deposited by DCMS was much higher than that of HPPMS; Ti-Cu films prepared by HPPMS is smooth and dense, titanium and copper were uniformly distributed in the surface of films, the Cu in the Ti-Cu films increased with increasing Cu in target and increasing voltage. The solid solution phase of Ti was formed in Ti-Cu films. Compared with the substrate 316L, the corrosion resistance of Ti-Cu films improved, the corrosion resistance decreased with increasing Cu in films. The wettability of Ti-Cu films were between pure Cu film and and Ti film.The experiments of copper release, NO release and platelet adhesion of Ti-Cu films prepared by HPPMS and DCMS were performed. The behavior of copper release, the ability of catalytic NO releasing from SNAP by Copper were studied. The blood compatibility of Ti-Cu films was evaluated. The results indicated that rate of copper release from Ti-Cu films increased with increasing Cu of films, when SNAP was added, the release of Cu ions increase. The Ti-Cu films fabricated by HPPMS show the ability of releasing Cu ions to catalyze SNAP to generate NO; thus the platelet adhesion, denaturation and aggregation on both Ti-Cu films were significantly inhibited in the presence of SNAP, the increasing copper of films increased the inhibition of platelet.