The Method And Application Research Of Capacity Planning In IC Foundry

Today, semiconductor element services to us every hour and moment since TI andFairchild semiconductor invented the world’s first integrated circuit in1958. The globalsemiconductor industry is developing rapidly in the past few decades. Its output value hasgrown to$300billion.Semiconductor manufacturing is an industry which needs high technology, hugeinvestment and talent, and also need long construction period. With the updating ofproducts and function developing, makes multi-varieties and small-batch become the trendof semiconductor manufacturing. The industry has recognized the importance ofshortening the cycle time from product design, production and Customization.Overloading will lead to CLIP fail while low utilization will lead to long payback period.The capacity planning in one of the most challenging areas in semiconductormanufacturing, and becomes lots of experts’ research topic from university,semiconductor industry and consultants. The characteristic of complexity, reentrant, multiobjectives and multi constraints adds the difficult of capacity planning. This article willfollow the standard of SEMI-E10that designed by SEMI (Semiconductor Equipment andMaterials International), and study how to breakdown the equipment status, define andquantify the index, and set up the system. And according to the method of OEE（OverallEquipment Efficiency）calculation that SEMI-E79introduce, study how to do capacityplanning based on the research of equipment capacity management, product mix andprocess flow, etc.This article study and introduce the method of capacity planning in semiconductormanufacturing firstly, and then analyze the factors the will impact capacity, focus on howto get and quantify these factors. Also will study how to design equipment capacitymanagement system and the functions should have. The4th chapter will introduce how toset up the model for capacity planning and how to do analysis.