| Aluminum-chromium-phosphate(ACP) is a binder with high bonding strength, good thermal stability, simple preparation, easy to use, and excellent infrared absorbing propries. ACP not only can be widely used to bond various kinds of caremics, glass, metal, but also can be used as infrared stealth coating binder. In this paper, copper oxide, copper and composite curing agent was added to ACP, effects on the curing behavior of ACP with different curing agents has been explored, and the infrared emissivity was tested in the infrared band of1~22?m.Firstly, different content of copper oxide curing agent was added to the aluminum phosphate matrix, and the influence of the content of copper oxide on the curing temperature, bond strength, microstructure and infrared emissivity of the aluminum phosphate binder was studied. The curing characteristics and heat resistance of the system were studied by means of DSC-TG, SEM, XRD and IR.The results showed that adhesive strength reached optimum bond strength when the copper oxide content was 30wt% and cured at 210? for 3h. The binder was crystallized at 700?. And the infrared emissivity was tested in the infrared band of 1~22?m, The lowest infrared emissivity was 0.74 when the copper oxide content was 35wt%.Secondly, copper as curing agent, the effect of different content copper on the curing temperature, adhesive strength, microstructure and infrared emissivity of aluminum chromium phosphates were studied. The curing characteristics and heat resistance of the system were studied by means of DSC-TG, SEM, XRD and IR. The results showed that adhesive strength reached optimum bond strength when the copper content was 25wt% and cured at 140? for 3h. The binder was crystallized at 700?. And the infrared emissivity was tested in the infrared band of 1~22?m, The lowest infrared emissivity was 0.71 when the copper contentwas 25wt%.Finally, composite curing agent was consistde of different proportion of copper oxide and copper, Composition ratio of the composite curing agent,curing temperature, curing time, curing characteristics and heat resistance were determined by means of test bonding strength, DSC, SEM, XRD and IR. And the influence of composition ratio of the composite curing agent on the infrared emissivity was discussed. The results showed that adhesive strength reached optimum bond strength when composition ratio of compound curing agent was copper oxide 60%(18g, copper 40%(10g), and cured at 210? for 3h. The binder was crystallized at 700?. And the infrared emissivity was tested in the infrared band of 1~22?m, The lowest infrared emissivity was 0.72 when composition ratio of compound curing agent was copper oxide 10%(3g, copper 90%(22.5g). |
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