Modeling And Experimental Study On Heating Mechanism Of Ultrasonic Embossing

Ultrasonic embossing technology is an immature and potential forming method of microstructure on the polymer for the advantages of high forming precision,easy process control and high production efficiency.Especially applying to microstructure forming on polymer,ultrasonic embossing improves the safety and reliability of polymer MEMS micro devices operating in complex and terrible environment.Due to unclear heating mechanism of ultrasonic embossing,the influence of parameters on the ultrasonic energy control can’t be determined,which can’t meet the higher-precision requirement of micro-nano-forming.Therefore,it’s central to study the heating mechanism of ultrasonic embossing.In this paper,through the analysis of ultrasonic embossing process,the heating models of friction-viscoelastic mechanism was established,so the corresponding heating productions were obtained.The heating process of the friction-viscoelastic mechanism was calculated by MATLAB and the temperature distribution was obtained.Embossing pressure profile obtained by orthogonal experiments verified the friction-viscoelastic heating mechanism and the process parameters were optimized.In results,the study of ultrasonic embossing heating mechanism is helpful to elaborate the impact of process parameters on heating production systematically.It’s significant to realize large-scale production of ultrasonic embossing and digitize safe production information.