Study Of Thermal Assisted Ultrasonic Embossing For Polymer Microstructure

Polymer microstructure devices with its superior performance in various fields have a wide range of applications and research. Manufacturing and processing technology of the microstructure has become research focus in the field of MEMS. In many microstructure processing methods, ultrasonic embossing technology as an emerging manufacturing technology has many unique properties of fast, clean, economic and without introducing external materials. It has broad application prospects in micromachining. Ultrasonic embossing in the application of microstructure forming is still in its infancy, process parameter and control model on the influence law of forming effect is unclear, the interface temperature field in the imprinting process is not thorough and so on.Based on thermal assisted ultrasonic embossing, this article carried out a study of the production of the polymer grating chip microchannel. Thermal assisted ultrasonic embossing system was set up and the mold was produced using silicon wet process. The paper make an analysis of the ultrasonic embossing process parameters, heat-assisted temperature, the thickness of the polymer substrate, mold position on the causes and laws of the grating chip forming quality by designing orthogonal experiment, combined with the optimization of process parameters to achieve a better microchannel replication. In order to effectively improve the production efficiency and suit for the design and manufacture of three-dimensional multi-layer micro-structural devices, the process of ultrasonic embossing on both surface of microstructure was studied. The silicon molds with different microstructure graphics was produced by a wet etch process after the experimental program is determined, mold-polymer substrate-mold in the forming of double-sided embossing experiments was selected. This research analysis of ultrasonic embossing process parameters on the result of double stamping forming and find out the optimal process parameters through the design of orthogonal experiment; theoretical simulation and experimental analysis compared the law of influence on the double sided embossing microstructure copying rate for different substrate thickness; design different combinations of experiments to compare embossing law for different mold microstructure graphics,.Hncrgy control mode was selected to research the ultrasonic embossing process, design a set of orthogonal experiments and analyze the effect of process parameters on the replication rate of the micro-structure for energy mode. The experiment of single factor variable was designed to explore the influence of energy mode ultrasonic process parameters on embossing process of the polymer substrate. Compared with time mode, the controllability of energy mode ultrasonic embossing was researched.To study the change of the temperature field in the process of the ultrasonic embossing forming interface, the theoretical analysis of ultrasonic embossing heat production mechanism was provided by the finite element simulation,and it provide an experimental basis. Temperature testing device was built through using thermocouples and carried on the imprinting process temperature measurement. Embossing parameters were analyzed to study the influence of them on the heat production rate and embossing by the temperature curve. Through comparing the temperature curves whether with heat assisted or not in the ultrasonic double-sided embossing process, the heat assisted can speed up the rale of heat production to achieve higher heat temperature and to improve the uniformity of embossed double-sided microstructure.