Research On The Grinding Process Of High-purity Tungsten

Tungsten is a metallic material with excellent physical and chemical properties,it has been widely used in aerospace industries,electronic industries,and chemical industries.In the applications,the surface topography and surface quality were strictly required.But as a typical high hardness metal material,it was difficult to process tungsten,mainly showed high grinding force,high surface roughness,more grinding burns,and severe grinding wheel wear.Therefore,seeking a suitable grinding wheel to process the high-purity tungsten,conducting research on the influences between grinding parameters and grinding quality is necessary.Comparative grinding tests were conducted with green silicon carbide grinding wheel,white fused alumina grinding wheel and diamond grinding wheel to research the grinding performance of different grinding wheels for the grinding of high-purity tungsten.Green silicon carbide grinding wheel showed better grinding ability.Process tests were conducted with green silicon carbide grinding wheel to analyze the variation tendency of surface roughness,grinding force and grinding energy with different grinding parameters and optimize the process parameters for the grinding of high-purity tungsten.The removal of tungsten by green silicon carbide grinding wheel was analyzed.The wear and blockage of the grinding wheel were also observed and analyzed.The specific works include:(1)Grinding tests with #80 vitrified bond green silicon carbide wheel and white fused alumina wheel,resinoid bond diamond wheel were conducted.The surface roughness and surface topography were observed and analyzed.Test results showed that in the two teams of the test,for the samples with green silicon carbide grinding wheel,surface roughness was smaller,surface topography was better,and the cracks were fewer.Green silicon carbide wheel showed the advantage in the grinding of the high-purity tungsten.(2)Single-factor grinding tests with green silicon carbide grinding wheel on high-purity tungsten were conducted with the parameters of grinding wheel liner speed vs,grinding depth ap and table speed vw.The influences of grinding parameters on the surface roughness,grinding force,grinding ratio and grinding energy were investigated,and the mechanism was analyzed.With the test results,considering the surface roughness,grinding force and grinding efficiency,the applicable grinding parameters for tungsten were: linear speed of grinding wheel vs=23 m/s,depth ap=8 ?m,table speed vw=10 m/min.(3)The surface topography was observed to analyze the removal of tungsten in the grinding process.The wear and blockage of the green silicon carbide grinding wheel on the grinding to tungsten were researched,some of the grains showed abrasion wear,and the surface of grains was blocked by material adhesion in small scopes.