Preparation And Application Of Low-temperature Curing Structural Epoxy Adhesive

In this study,a kind of epoxy resin stone dry adhesive with low toxicity,low viscosity,low curing temperature and good mechanical properties was prepared.The main research work included two parts:In the first part,through optimized screening and analyzing all the components of the formula of low temperature curing epoxy adhesive,the influence of each component on the properties of adhesives has been studied,the kinds,the dosage and the best ratio of each component determined,eventually the formula of the low temperature curing two-component epoxy adhesive determined.The experimental results showed that selecting modified bisphenol A epoxy resin 816 with low viscosity remixed with bisphenol F epoxy resin 862 as the matrix resin,the complex ration 1:1 for the matrix resin,mixed aliphatic amine 6610 as the curing agent,and addition of the the core shell rubber(MX)4% as the toughening agent,addition of DMP-30 2% as the curing accelerator,ZT-100/A23 mixture as the reinforcing filler and the complex ratio 1:1,adding 6% H18 as the thixotropic agent,4% KH550 as the coupling agent,the low temperature curing epoxy adhesive with good comprehensive performance could be prepared.The SEM analysis indicated that when the ratio of m816 and m862 was 1:1,filler packed densely with good compatibility and the section was smooth.The holes in the MX toughening agent system could be observed,and the induced stress concentration caused shear deformation in the internal of the epoxy curing agent,so the toughness was improved through the absorption and dissipation of impact energy.TG analysis suggests that the heat resistance of ZT-100/A23 complex system was slightly lower compared with ZT-100 system.The results of DMA shows that there was only one peak of the curing agent,that was,only one glass transition temperature,which meant good compatibility of the components of the system.Moreover,the loss factor tan? increased due to the addition of MX toughening agent,thus the toughness enhanced.In the second part,the formula of the low temperature curing epoxy adhesive was tested,and the comprehensive performance of the products was evaluated and analyzed,the factors influencing the properties studied.The experimental results showed that the properties of this kind of low temperature curing epoxy adhesive properties were in line with the normal temperature curing standard of JC 887-2001 "The epoxy resin adhesive used for dry hanging stone curtain wall ",even better than other commercially available products and could be more widely used for various substrates.It can meet the requirements of curing at a low temperature,especially the construction in winter in North China,so the construction in all kinds of conditions can be realized.