Study Of The Improvement Of Dimple Ratio On TFT-LCD Etched Glass

TFT-LCD、 OLED or other display technology IT products,light and thin are two core competitive elements.It is generally used to reduce the thickness of glass substrate and reduce the thickness and weight to match the market competition.At present,it is difficult to make the panel production process of etched glass substrate thickness,and the glass thinning process comes into being.To achieve good glass surface effect after thinning,we need to in-depth analysis thinning process and thinning dimple formation mechanism,and optimize the existing technological process.We expect to reduce the production cost,and improve the quality of glass surface after thinning,under the premise of efficiency and automation,.This paper briefly introduces the theory of thinning,the classification of thin technology and the main technological process of thinning,so that readers have a preliminary understanding of the thinning process.This paper mainly analyses the formation mechanism of etch dimple and key influencing factors,and provides theoretical guidance for further research.The improvement of the key factors for each process,this article mainly through investigating other company’s contact structure materials and other company’s case analysis about etch dimple,and combined with our actual situation,assess the risk grade,in view of the high risk rating structures,optimize design of mechanism and select reasonable materials.At the same time,we need to optimize the thinning parameters by doing the DOE experiment.In this way,by improving this two dimensions,the etch dimple loss was effectively improved,and the loss rate of the etch dimple was significantly lower than the industry average.In addition,the research results of the contact mechanism of the equipment are also provided in this paper,which provides guidance for the selection of equipment structure to the new TFT LCD factory.