| The liner bonding technology is the key factor to ensure the service performance and service life of self-lubricating spherical plain bearings. Because the present research on the bonding technology is not enough, and it has not formed a standard system of liner bonding technology yet, it has important theoretical value and practical significance to study the liner bonding technology of self-lubricating spherical plain bearings and optimize its parameters. The main work is as follows:First of all, according to the bonding requirements of the self-lubricating liner, the curing fixture was designed. And according to the requirement of the United States military standard AS81819, the measuring instrument of peeling strength was designed for evaluating the liner bonding strength effectively.Secondly, the liner bonding process was numerically simulated with ANSYS simulation platform. In order to get the temperature and stress distribution of the liner in the bonding process, the thermal-structural coupling model was set up, and it laid the foundation for setting the curing parameters in the liner bonding test.Thirdly, the experimental scheme of liner bonding was designed, many details were studied, for example, the selection of test specimens and adhesive, the determination of loading scheme, and the steps of liner bonding test. Simultaneously, the data processing method of the peeling test, and the calculation formula of accurate peel strength and deviation coefficient were provided.Finally, using orthogonal test method, the liner bonding test was conducted in accordance with three bonding parameters, which were the curing process parameters,surface roughness and the quantity of adhesive. The peeling strength of the liner was regarded as the evaluation standard of bonding strength, so it had to complete the liner peeling test, and get the peeling curve of each test specimen. The test results were summarized and analyzed, and the various parameters impact on the liner bonding effect were compared, and then the optimal parameters in the bonding technology were obtained. |