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Numerical Simulation Of High-Power LED Cooling Based On Heat Pipe Radiator With Fins

Posted on:2016-03-18Degree:MasterType:Thesis
Country:ChinaCandidate:R WangFull Text:PDF
GTID:2322330488995501Subject:Refrigeration and Cryogenic Engineering
Abstract/Summary:PDF Full Text Request
Light emitting diode (LED) is a new light source which has the advantages of energy saving, environmental protection, long lifetime compared with traditional fluorescent and incandescent lights. It is the development trend of lighting. But the problem of LED chip easily overheating has constrained the development of LED, therefore excellent thermal cooling technologies and structure are essential to apply to the LED. Aiming at this critical problem, A new type of the finned heat pipe radiator had been studied in this thesis.The main contents are as follows:(1) The main cooling technologies applied to the high-power LED were collected and analyzed. A new finned heat pipe radiator is presented according to the characteristics of high-power LED, such as heat concentration and the large heat flux density. (2) A new type of vertical fin heat pipe radiator was designed and verified for a total power of 15W multi-chip LED device. According to the LED thermal resistance network,the total thermal resistance of LED cooling system was calculated, and then it is obtained that the LED chip temperature was 74.8?.(3) The thermal simulation analysis of high power LED which based on finned heat pipe structure is calculated by ICEPAK software. When solving process finish, the results showed that the temperature of LED chips is 76.2?. Finally, the structure of the cooling system was optimized.Gradual study results are as follow:(1) A new type of vertical fin heat pipe radiator was designed for a total power of 15W multi-chip LED device. The result of the entire cooling system theoretical calculations and numerical simulation show the availability of the finned heat pipe radiator and the error of them are 1.8%.(2) Aiming at the fin structure of LED cooling system, the number, highness and thickness of fins which have influence on the temperature of LED chip are comparatively analyzed. The results show that the height of fin is the most significant effect on the capabilities of the radiator. (3) By comprehensive consideration, when the fin number is 18, the fin height is 20mm, the fin thickness is 0.7mm, the heat dissipation function of cooling system is best.
Keywords/Search Tags:high-power LED, chip temperature, ICEPAK, heat pipe, fin, thermal resistance
PDF Full Text Request
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