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Study On Micro-topography Of Surfaces On Liquid Film Formation And Its Influences

Posted on:2018-11-04Degree:MasterType:Thesis
Country:ChinaCandidate:L H D D E H JiangFull Text:PDF
GTID:2322330533956461Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
Experimental results effects of micro-topography of surfaces obtained by grinding and electrochemical finishing process(ECFP)on liquid film thickness was analyzed using finite on difference numerical method which establish mathematical model by combining with the conformational analysis of the micro-topography of surfaces based on fluid lubrication theory.Using matlab software programming,obtained liquid film pressure distribution of 3 kinds of rectangular,tapered and trapezoidal section with different depths and uneven distribution under given conditions and the influence of the distribution of microstructure units on the liquid film pressure,the mechanism of the influence of different micro-topography of surfaces on liquid film formation and its influences is analyzed.The results show that: The surface micro-modelling make the surface geometry to uneven shape which is helpful for forming the dynamic pressure effect;On the same conditions,comparing with the grinding process,the micro-topography of the surfaces obtained by ECFP can provide thicker liquid film thickness and stronger dynamic pressure effect which is favorable for the lubrication;Distributed the micro-geometries on the surface can make the liquid film pressure to uneven distribution,the membrane pressure on the surface are volatile and is helpful for forming the pumping effect.Experiment validate: oil film thickness obtained by electrochemical finishing process(ECFP)greater than oil film thickness obtained by grinding.Improvement of mechanical seal performance is not limited to the regular,regular distribution of uneven surface geometry,and irregular and randomly distributed surface geometry can improve the performance of mechanical seal.
Keywords/Search Tags:Surface micro-topography, Dynamic pressure effect, Pumping, Electrochemistry, Finishing
PDF Full Text Request
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