Font Size: a A A

Research On Design And Performance Of Semiconductor Refrigeration Fin Heat Sink Based On Flat Heat Pipe

Posted on:2017-04-09Degree:MasterType:Thesis
Country:ChinaCandidate:Z J GanFull Text:PDF
GTID:2352330485996717Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
With increasing science and technology, people's life quality is becoming more and more high, at the same time, the terms of the quality of people's requirements and to higher. Especially in the aspect of refrigeration, for the traditional compression refrigeration noise big, big volume, these shortcomings such as refrigerant leakage to the environment pollution caused by the people is more and more difficult to accept. In the face of this background, the new type of semiconductor refrigeration technology to further research and development. Semiconductor refrigeration technology advantage many, small volume, no mechanical movement, in the process of work there is no noise, do not contain refrigerant, friendly to environment. However, due to the semiconductor refrigeration efficiency is very low, is not nearly as traditional refrigeration efficiency, so can't widely practical application. The semiconductor refrigeration piece of hot side heat dissipation effect is one of the important factors directly affect the efficiency of semiconductor refrigeration.This article research mainly on the semiconductor refrigeration piece of hot side heat analysis,and design of flat heat pipe radiator:Analyzing the working condition of semiconductor refrigeration piece by calculation and analysis of radiator thermal resistance is calculated.Use Icepak electronic thermal simulation software on a flat plate heat pipe radiator respectively, the common heat pipe radiator and fin type radiator has carried on the simulation analysis,Heat pipe radiator cooling efficiency is better than that of the heat pipe radiator, and the flat heat pipe radiator cooling efficiency is superior to the common heat pipe radiator.Through under different working conditions, simulation analysis was carried out on the flat heat pipe radiator,Environment temperature is higher, the flat heat pipe radiator temperature is higher, its heat transfer performance is poor;Air flow speed, the greater the flat heat pipe radiator temperature is lower, the better the performance of its heat transfer;Heat source power, the greater the flat heat pipe radiator temperature is higher, its heat transfer performance is poor.Through constructing experimental platform on a flat plate heat pipe radiator, the common heat pipe radiator and fin type radiator were analyzed; On a flat plate heat pipe radiator working condition of the experiment analysis; The flat heat pipe radiator for different type of semiconductor refrigeration refrigerator experimental analysis.Use Icepak electronic thermal analysis software on a flat plate heat pipe radiator has carried on the simulation, The simulation data and experimental data are analyzed in comparison, found that the experiment and simulation results are similar, to determine the model is reliable and can carry out simulation products, reduce the design cost.
Keywords/Search Tags:Semiconductor production, Flat heat pipe radiator, Heat transfer property, Experimental analysis, Simulation analysis
PDF Full Text Request
Related items