Study Of The Hot And Cold Side Heat Transfer Characteristics Of Semiconductor Refrigeration Box Based On The Heat Pipe Radiator

Semiconductor refrigeration technology is a new pollution-free refrigeration technologyand has been widely used in many fields. How to effectively improve the heat transfer of thehot and cold side of the semiconductor refrigeration tablets and thereby improving theefficiency of semiconductor refrigeration, has been one of the hot research. The heat pipe hasgood thermal conductivity, and heat pipe radiator has produced compact small size, good heattransfer, then the heat pipe radiator is applied to the semiconductor chip cooling cold timelydissemination of demand-side heat is applied to the semiconductor refrigeration cooling andmeet the cooling demand. This article will use heat pipe radiator in the semiconductor coolingdevice, and then using a combination of experimental and simulation methods to study itsheat transfer characteristics.First, experimental research and data analysis of the heat transfer characteristics of thesemiconductor devices with heat pipe radiator has been carried out. Discussed the thermalsilica, different power semiconductor refrigeration tablets, forced air cooling and naturalcooling effects on the heat transfer performance of the semiconductor cooling device hot andcold side. The heat transfer effects of semiconductor cooling device with a heat pipe radiatorand semiconductor cooling device with the fin has been analyzed and compared. Thesteady-state heat transfer characteristics of semiconductor cooling device with the heat piperadiator have been studied. Then the heat pipe radiator of semiconductor cooling devices hasbeen simulated use the fluent software based on the experimental. The simulation obtainedtemperature field and flow field of the heat pipe radiator and compared of the experimentalresults. Then the heat pipe radiator has been simulated optimization using the establishednumerical model.Through experiments and numerical simulation of semiconductor cooling devices basedon heat pipe radiator, the following conclusions can be obtained: The thermal silica isconducive to the hot side heat transfer of semiconductor cooling device. For different powersemiconductor refrigeration components, the higher the power is, the larger the heatproduction, and cooling requirements also will increase. The heat transfer effects of the heat pipe radiator are better than that of finned radiator. The hot side of semiconductorrefrigerating box with heat pipe radiator using fan cooling can enhance the cooling of the hotend. The hot side temperature is higher than the ambient temperature around10℃, while theaverage temperature in semiconductor refrigerating box is about7℃.The simulation results using solver based on pressure-based implicit solver, SIMPLEalgorithm, k-ε turbulence model, second-order upwind scheme for solving the accuracy aresimilar with experimental results, the model is accurate and reliable, can be used foroptimization of simulation products. The greater the wind speed is, the lower the temperatureof the heat pipe radiator, and then the better the heat transfer; The smaller the air temperatureis, the lower the temperature of the heat pipe radiator, and then the better the heat transfer;With the fin spacing increases, the temperature of the heat pipe radiator rising, and then heattransfer effects worse.