Preparation Of The Transparent Epoxy Molding Compounds For SMD LED Package

As the light emitting diode is more and more widely used in the productions and livings,about the need of transparent packaging material-s for LED is increasing.At present,SMD LED packaging materials mainly rely on importing in the domestic and they are expensive,which brings a lot of economic burdens to enterprises.In this paper,the main work is about that the preparation of transparent epoxy molding compound matrix resin,exploration and design the formulas of transparent epoxy molding compounds,and make the analysis of curing kinetics analysis and performances.The ultimate goal is to design the optimal formula which meets the requirements of standard performances.Using bisphenol A type epoxy resin,epoxy chloropropane,NaOH and catalyst on the basis of raw materials,the hydrogenated bisphenol A type epoxy resin,has a higher oxidation resistance and yellowing resistance,is prepared through the etherification reaction and cyclizationreaction.By FTIR and TG tests of synthetic product hydrogenated bisphenol A type epoxy resin with Japan YX8040 contrasting,experiment–tal results found that the peaks are same.Experimental results found that the yield of hydrogenated bisphenol A type epoxy resin with the highest experimental conditions is that the dosage of solvent 50 ml,hydrogen:ring for 1:5,experimental temperature 50 ?.Bisphenol A type epoxy resin-four hydrogen of benzene anhydride curing system is ananysised by DSC.Analysis results showed that 2-methyl imidazole accelerator effect is faster than N,N-dimethyl benzyl amine,tetrabutyl ammonium bromide.And through the orthogonal experiment analysis,in the three factors of types of matrix resin,curing catalyst dosage,curing catalyst types,the kinds of curing catalyst for curing activation energy is the largest.Vision of the exploratory experiment found that add transparent cyanuric acid three glycidyl ester,the elastic modulus of transparent epoxy molding compound,volume resistivity and glass transition temperature(Tg)has obvious enhancement.Poor orthogonal test analysis and calculation results showed that the resin types had the greatest influence on the properties of transparent epoxy molding compounds.The optimum formula is 47% bisphenol A type epoxy resin,hydrogenated bisphenol A type epoxy resin 17%,three different cyanuric acid glycidyl ester 5%,four hydrogen of benzene anhydride 29.8%,2-methyl imidazole by 1.1%,2% other functional additives.