Study On Preparation And Properties Of TiN?TiAlN Films By Magnetron Sputtering Ion Plating

Magnetron sputter ion plating(MSIP)is widely used in the field of thin film deposition,the obtained coating has the advantages of good quality,high binding force between the film and the substrate(dele),easy to design etc..Improve service performance and life of cutting tools,drill bits and other tools.TiAIN coating as a novel coating material has the excellent characteristics compared with TiN,such as high hardness and oxidation temperature,good corrosion resistance and abrasion resistance.Therefore,TiAIN coating has a quite broad application prospects.In this paper,TiN,TiAIN films on the surface of YG6 Carbide have been prepared used the CH850-type magnetron sputter ion plating merhod.The phase structure,surface and fracture morphology,composition and performance were confirmed by XRD,SEM,EDS,stereo microscope,micro hardness tester and scratch tester.The XRD analysis indicated that the TiN film's crystal plane preferred orientation is(111)and at the interface of the film-substrate exist TiC phase.Ti3 AlN?AlN phase mainly existed in the TiAIN films.The structure is wurtzite hexagonal structure.Ti3AlN phase bent along the(220)preferred orientation and the diffraction peaks shifted to the high-angle region.Target current and substrate bias are important process parameters which affect the phase structure and the thickness of the film.The SEM and EDS analysis indicates that with the Ti target power and the bias increaseing,the crystallization ability of the TiN film has improved and the density has increased while roughness has reduced.The obtained Film-substrate has a more closer solid linked,meanwhile existing a decarburized layer betweet them.The thickness of this kind of film can reach to 3.19?m.Ti target power decide the ratio of N/Ti atomic;with the A1 target power increaseing,the grain of TiAIN changes from loose granular structure to the compact strip-shaped structure,surface roughness is reduced,A1 has the role of grain refinement.The interface of the film and the substrate is obvious and combine firmly;the film has dense structure and good uniformity.The film thickness can reach to 1.93?m.A1 target power directly affects the content of A1 in the film,while the ratio of the N atoms and the metal atom has little effect.The ratio closes to 1:1.Sputtering power affect the color and bias affect the gloss of the film.N/Ti atomic ratio is the main influence factors of TiN color.With the Al target power increases,the TiAIN color become blacker.With the bias increases,gloss increased firstly and then decreased.The the microhardness and adhesion test results showed that the hardness of TiN film can reach 2417HV,the adhesion force of film-substrate up to 60N.Appropriate bias and deposition temperature help to enhance its hardness,The TiC phase,the appropriate substrate material and pulse superimposed DC bias technique improve the film-substrate adhesion.TiAIN film hardness can reach 3145HV,film-substrate adhesion of up to 85N.Microhardness would increase as the bias rising,while it would increase first and decrease after as the power rise of the Al target.The hardness of the film has significantly enhanced due to the presence of Ti3AlN hard phase,while too much AIN soft phase would just do the opposite.TiN transition layer,Al target power and substrate bias affect the film-substrate adhesion.