Development Of Chip-reinforced And Fixed Light-heat Dual-cure Packing Material

Chip-reinforced and fixed light-heat dual-cure packing material is mainly used in the field of camera module and other small,microchip COB CSP VCM BGA and AA process packaging.It has the advantages of fast light curing rate and accurate orientation,low temperature heat curing,low curing shrinkage and so on.Which overcame the viscosity and stability of the traditional glue solution by dropping glue,and the overflow glue would erode the chip and lead to the decline of the finished product rate.So develop this kind of chip-reinforced and fixed light-heat dual-cure packaging materials is very important for the reliability,stability and production efficiency.In this paper,the bisphenol A epoxy resin 828el and modified alicyclic epoxy resin 2021P compound as resin system,Irgacure261 as cationic photoinitiator,boron trifluoride monoethylamine as heat curing agent,white carbon black as thickener,and active silica powder as filler all these mixed preparation glue solution.Studied the effect of resin component,cationic photoinitiator,and heat curing agent on the light-heat dual-cured packaging material.Through the UV energy meter,DSC and GT,FTIR test to determine the curing process,At the same time,through the Microcomputer controlled electronic universal test,Dielectric constant test,Shore D hardness,HAAKE Viscotester,TMA,DMA,TGA and High and low temperature alternating humidity test chamber,studied the addition of fillers and thickeners to the bonding strength,dielectric constant,hardness,viscosity and shrinkage,storage modulus,and stability of the chip packaging materials.The results show that when the mass ratio of modified aliphatic epoxy resin 2021p:bisphenol A epoxy resin 828el:Irgacure261:boron trifluoride monoethylamine:active silica powder is 90:10:3:2.5:40,the curing process system is as follows:UV energy is 2800mJ/cm2 can achieve dry,80°C/30min complete curing;bonding strength is 25.19MPa,dielectric constant 4.6,hardness 77D,viscosity of 17900CPS,CTE of 130ppm/?(55??70?),240ppm/?(115?-130?),DMA test Tg of 150?,storage modulus of 2244MPa(25?)and 2078MPa(50?),The moisture absorption rate is 0.131%,and the thermal stability is good.The high-low temperature test can maintain the bonding strength of 98.78%(23.42MPa),and high temperature and humidity aging can maintain the bonding strength of 84.40%(21.26MPa),which can meet the technology requirements of the production process,and meet the use of performance.