Study On Grinding Temperature Field Of Hard And Brittle Materials In Ultrasonic Vibration Assisted Micro End Grinding

In recent years,rapid development of hard and brittle materials has been promoted in aerospace,precision machinery,medical equipment and other fields.However,due to the improper selection of grinding parameters in the grinding process,there exists high grinding force,high grinding temperature and poor machining surface quality.Therefore,its further promotion of use is limited.Research shows that mechanical-ultrasonic vibration compound machining technology can effectively reduce the grinding force and grinding temperature,inhibition of grinding wheel wear,etc.Hence,this article puts forward a kind of ultrasonic vibration assisted micro grinding technology to solve the problems existing in hard and brittle materials processing.Considering the grinding temperature not only can directly reflect the grinding conditions,but also is an important parameter in the grinding process.Therefore,this article is based on ultrasonic vibration assisted micro end grinding-UAMEG and to study the grinding temperature field of hard and brittle materials which has important theoretical and application value.This article main research content is as follows:Firstly,the theoretical analysis of grinding temperature field in UAMEG is conducted.The energy distribution ratio model of UAMEG is established.The heat flow transferred to the workpiece is achieved based on energy distribution ratio model.Through analyzing the characteristics of the circular heat source,the analytical model of grinding temperature field of UAMEG is developed.Then,the analytical model of silica glass is simulated and analyzed through MATLAB.Secondly,in order to verifying the theoretical analytical model and facilitating to display the grinding temperature field intuitively,the finite element model of UAMEG is established based on ANSYS.The three-dimensional finite element simulation of UAMEG is achieved through APDL language.The simulation results intuitively reveal the morphological characteristics and variation tendency of the three-dimensional temperature field.The trend of grinding temperature field and the border size effect of silica glass are analyzed in different grinding parameters.At last,to verify the correctness of the simulation results and the influence of ultrasonic vibration on grinding temperature field,the experimental platform of UAMEG is designed.Through the thermocouple temperature measurement method,the orthogonal temperature measurement experiment of silica glass was carried out.The results show that: through introducing ultrasonic vibration,the grinding temperature is significantly reduced under different grinding parameters.The experimental measured temperature is consistent with the predicted results of analytical model and finite element simulation,but they also produce certain errors.Then,the produced errors are analyzed in detail.