Study On Preparation And Properties Of Insulation And Thermal Conductive Composites With High Infrared Emissivity

As the quality of people's life is increasing,mobile phone,computer and other electronic products become a necessity of life.In order to solve the problem of heat dissipation of micro-electronic components in electronic products,the thermal conductive filler was prepared in this paper including Magnesium Oxide,tourmaline,and graphene.It can be used in the field of electronic packaging.Magnesium Oxide is the adjustor between tourmaline and graphene.Magnesium Oxide,tourmaline,and graphene are uniform,integrated,interactive,compatible as a whole,reveal their unique advantages.The addition of tourmaline can make the prepared thermally conductive filler complex become a radiation source with high infrared emissivity,which can radiate energy to the surroundings and improve the heat transfer efficiency.Graphene with high thermal conductivity and large specific surface area,When dispersed in the polymer resin matrix,it can become the link between the filler and the filler,which can effectively contact with each other to form a heat conducting channel.In graphene and tourmaline surface coated with a layer of nano particles of Magnesium Oxide,which can effectively fill the void in graphene due to the formation of wrinkles.Not only to enhance the heat transfer efficiency between the graphene layers,but also blocked the formation of conductive channels.Firstly,MgO particles and graphene/tourmaline composites?T-G?were prepared and itsperformancewascharacterized.On this foundation,aseriesof MgO/tourmaline/graphene composites materials?MgO-T-G?with high infrared radiation were prepared by means of a combination of standing volatilization and hydrothermal methods.And characterized by XRD,XPS,SEM,TEM,FTIR,Raman,Infrared Emission.The experimental result indicated that the maximum infrared emissivity of MgO nanoparticles is 0.857 in the 2000⁶00 cm^-1 band,T-G is 0.942 and MgO-T-G is 0.959.Finally,in order to investigate the effect of the ratio of filler MgO-T-G and the amount of filler on the properties of epoxy resin?EP?,the MgO-T-G/EP composites were prepared by adding MgO-T-G composites into epoxy resin and its morphology,insulating properties,thermal properties and mechanical performance were tested.Studies have shown that when MgO-T-G with the highest infrared emissivity was selected as the filler,the thermal conductivity of MgO-T-G/EP is as high as 0.602 W/?m·K?,which is increased by about 156%compared with pure epoxy resin[0.235 W/?m·K?]and it is an insulating material.Furthermore,when the mass fraction of the filler is 60%in MgO-T-G/EP,the thermal conductivity is up to 0.847 W/?m·K?,which still meets the requirements of insulating materials,the microstructure of composites is relatively flat and the mechanical properties of the composites are decreased,but the decrease is not significant compared with pure epoxy resin.Thus,the filler material with good insulating properties,thermal conductivity and heat radiation has a high application value in the field of thermal packaging materials of electronic products.