Study On Machining Technology Of Aluminum Oxide Ceramics Baded On Fiber Laser

Alumina ceramics belong to super hard materials.General cutting tools are easy to cause material damage and damage to processing equipment.With the development of science and technology,the requirement of microporous technology and precision for ceramic substrates has changed dramatically in the field of electronic industry.In particular,for the requirement of microporous processing of alumina ceramic-based materials,microporous processing requires super-high processing accuracy while ensuring processing efficiency.Laser processing,as a special processing technology,has been widely used in the processing of alumina ceramic matrix materials,especially high-power optical fiber laser processing technology.The application of this technology greatly improves the demand of scribe and hole drilling of ceramic matrix materials.Based on the microporous processing of 96 alumina ceramics,the influence of optical fiber laser on the scribe and punching process of 96 alumina ceramics under different parameters is discussed,which provides a theoretical basis for the industrialized application of 96 alumina ceramics substrates.The main achievements of this paper are as follows:?1?In view of the unique characteristics of laser processing of ceramic substrates,a set of dual-position fixture device for ceramic substrates is designed and further optimized,which solves the instability of ceramic substrates clamping and reduces the pollution of laser cutting head caused by processing powder layer.?2?Complete the basic research on the scribe of 96 alumina ceramic substrates in the QCW mode and CW mode of optical fiber laser.For the two pulse modes,the optimum parameters of 1₂ and 1₃ scribed depths of ceramic matrix materials with different thickness?0.4 mm,0.6 mm,0.8 mm,1 mm?are optimized.In CW mode,absorbent solvents are needed to solve the problem of scribed points and broken lines,but not in QCW mode.The speed of 200mm/s in CW mode and 150mm/s in QCW mode are realized.At the same time,when the average output power is constant,the higher duty cycle,the worse the quality of the laser marking;the relationship between the depth of the laser marking and the laser power is approximately proportional.?3?Laser drilling experiments were carried out using QCW mode of quasi-continuous laser.According to the single variable control method,the effects of repetition frequency,scanning speed,duty cycle,defocusing volume and air pressure on the aperture of the outlet and entrance of the micropore and the quality of the aperture were studied respectively,and the variation trend of the scribe width during pulse drilling under QCW mode was analyzed.?4?The results show that the taper of micro-pore on 0.635 mm thick ceramic-based material is the smallest 1.14 degree.The drilling parameters are as follows: repetition frequency 200 Hz,duty cycle 20%,defocusing amount 0,pressure 0.3 MP,scanning speed 240 mm/min,power ratio 15%.The influence degree of the taper is defocusing amount,pressure,repetition frequency,duty cycle,laser power ratio,scanning speed in turn.The defocus is the highest and the scanning speed is the lowest.