Study On The Preparation And Cutting Performance Of Electroplated Super-hard Abrasive Saw Wire Based On Processing Object

In recent years,with the rapid development of photovoltaic industry,electroplated diamond wire saw cutting technology has been widely used in the chip processing of photovoltaic silicon crystal.In order to reduce the cost and optimize the photovoltaic chip technology,it is required to reduce the kerf loss as much as possible to improve the silicon crystal utilization.#hen the diameter of the wire is reduced,the kerf loss will be reduced.At present,the diameter of the wire used in the chip processing of photovoltaic silicon crystal has been reduced to 60?m or even finer.However,due to the large size of KDP crystal and the length of sawing kerf(some larger than 1000mm),the lubrication and chip removal performance of sawing area are required to be higher.Different processing objects have different requirements for wire.In this paper,the preparation of electroplated superhard abrasive wire saw is mainly based on the processing objects(photovoltaic silicon crystal and KDP crystal).For the wire used in the field of photovoltaic crystal silicon chip,considering the technical requirements of silicon crystal chip and the finer diameter of the wire at present,the high carbon steel wire with a diameter of 60 ?m is used as the saw wire matrix,the diamond with a size range of 8-10 ?m is used,and the suspended sand method is used in the electroplating solution with nickel sulfamate as the main salt.The processes of pre plating,sanding and thickening are systematically studied.Based on the analysis of sawing performance,the suitable combination of electroplating process parameters for the preparation of electroplated diamond wire saw with high sawing performance is obtained.For the wire of large-scale KDP crystal cutting,considering the material characteristics of KDP crystal,the difficulty of chip removal and the poor flow of cutting fluid,etc.,the electroplated abrasive wire saw with spiral arrangement of surface abrasives is prepared,and the chip holding groove is left on the surface,so as to improve the flow and chip removal of cutting fluid,improve the cutting surface quality of sections,and determine the reasonable surface structure parameters of wire.The results provide experimental basis and reference for the preparation of electroplated wire saw for different machining objects.The main research work of this paper is summarized as follows:(1)The high carbon steel wire with a diameter of 60?m is used as the matrix,the nickel plated diamond with a size of 8-10 ?m is used as the abrasive,and the manufacturing process of the electroplated diamond wire saw is formulated;the experimental materials for the preparation of the wire saw and the pretreatment process of the matrix are determined;the experimental parameter design scheme and the performance characterization of the wire saw at each stage of the preparation of the electroplated wire saw are determined And evaluation methods.(2)The preparation experiment of electroplated wire saw for photovoltaic silicon crystal chip was carried out.The influence of the process parameters of pre plating,sanding and thickening on the quality of wire saw was systematically studied.The reasonable process parameter range and parameter combination were obtained.The sawing experiment of photovoltaic polysilicon was carried out.The sawing performance of the wire saw was analyzed from the aspects of chip morphology,surface roughness and kerf width,which confirmed the rationality of the combination of preparation parameters of the electroplated wire.(3)The high carbon steel wire with a diameter of 0.8 mm is used as the matrix,and the SiC abrasive with an average diameter of 120 ?m is used as the abrasive.The manufacturing process of the electroplated abrasive wire saw with the surface abrasive group spiral arrangement is formulated.The experimental materials for the preparation of the wire saw,the pretreatment process of the matrix,the sanding method and the technological parameters of each electroplating process are determined.The main table for the preparation of the wire saw is analyzed and designed Face structure parameters.(4)Different surface structure parameters were selected to prepare the electroplated wire saw for KDP crystal slicing,and the sawing experiment of KDP crystal was carried out.The influence of different surface structure parameters on the sawing performance of wire saw was studied from the aspects of sawing efficiency,cutting width,roughness of workpiece.Reasonable surface structure parameters of wire saw are obtained.