Analysis And Experimental Research On The Longitudinal Motion Characteristics And Influence Of Reciprocating Diamond Wire Saw

Hard and brittle materials such as single crystal silicon,optical glass,sapphire,etc.are widely used in military and civilian industries due to their good physical and chemical properties such as high hardness,high wear resistance,corrosion resistance,oxidation resistance,and high resistivity.Due to the hard and brittle nature of the material,the processing process is difficult.Currently,the reciprocating diamond wire saw cutting has many advantages such as high efficiency and narrow slits,and has become a promising cutting technology in the field of silicon wafer cutting.However,the movement characteristics of the wire saw in the cutting process have a great influence on the surface quality of the workpiece.Therefore,to obtain a better surface quality of the workpiece,it is urgent to study the cutting force and the formation of the workpiece surface topography.During the cutting process of the reciprocating diamond wire saw,the longitudinal displacement movement of the wire saw in the error-sensitive direction leads the scratches on the cutting workpiece surface.Therefore,based on the motion characteristics of the reciprocating diamond wire saw cutting system,the effect of workpiece surface quality and cutting force is studied.This paper discusses the analysis of the longitudinal movement of the wire saw in the reciprocating diamond wire saw cutting system,the implementation of the measurement system of the longitudinal displacement of the wire saw and the speed of the wire saw,the analysis and modeling of the longitudinal cutting force of the wire saw cutting workpiece,and the analysis of the surface topography of the wire saw cutting workpiece.Based on the analysis of the structural characteristics of the reciprocating diamond wire saw cutting system,analyse the longitudinal movement of the wire saw and model the longitudinal displacement of the wire saw and conduct the experiments when the wire saw is unloaded and the workpiece is cut.In order to improve the correspondence of the measured data in the experiment,a synchronous measurement system for longitudinal displacement and wire saw speed is built.The longitudinal displacement data of the wire saw collected by the laser displacement sensor is connected to the data acquisition system as a voltage signal,using virtual instrument software Lab VIEW to collect data.By programming,the synchronous measurement of the longitudinal displacement of the wire saw,the wire saw speed and cutting force data is achieved.Establish a single abrasive particle press-in model to obtain the cutting force of a single abrasive particle,simplify the distribution law of diamond abrasive particles on the surface of the wire saw,and obtain the total number of abrasive particles involved in wire saw cutting.According to the interaction of multiple abrasive particles,obtain the total cutting force generated by all abrasive grains.Combined with the longitudinal motion of the wire saw and the feed motion of the workpiece,two cutting partial forces in the longitudinal direction and the normal direction are obtained.Establish the longitudinal cutting force model,and compare the wire saw cutting experiment and simulation analysis.Analyze the surface forming method of the workpiece,based on the movement characteristics of the wire saw cutting system,analyze the relative movement between the wire saw and the workpiece,establish the sawing trajectory equation of the wire saw,and combine the workpiece feed motion to establish the three-dimensional motion trajectory equation of the wire saw on the workpiece surface,combined with the surface forming theory of the traj ectory method,establish a prediction model of the surface topography of the workpiece,and use a Leica microscope to measure the surface topography of the workpiece.The results show that the error between the simulation and the actual measurement is less than 7.82%.