Application Of The Adhesive Bonding Technology In Micro-assembly

As an important part of micro-assembly,adhesive technology is widely used in connection and fixation of microelectronic devices,LED packaging,micro-manufacturing and other fields.With the rapid development of micro-electromechanical system(MEMS)and the miniaturization of mechanical and electronic products,higher requirements are put forward for adhesive bonding technology.How to realize the micro-quantification,accuracy and uniformity of various adhesive interfacial patches is an important subject to achieve high quality and firm adhesion.It is of great significance to study the bonding technology in micro-assembly.The connection and sealing of micro-components in a small space are the difficulties in adhesive bonding technology.In order to solve this problem,this paper studied the connection,fixation and sealing between different hydrophilic interfaces of micron and submicron scale micro components.Firstly,the method and mechanism of adhesive bonding in the application of micro-assembly were analyzed,and the factors affecting the application performance of adhesive bonding were discussed.Then FLUETN software was used to build the microhydrodynamic simulation model of the adhesion process of different wettability adhesive interfaces.The dynamic process of spontaneous migration of the droplets due to the difference of wettability between two adhesive interfaces was analyzed by simulation.The influence of interface shape,roughness,adhesive position,microstructure and adhesive pressure on micro adhesive connection and sealing performance were studied.A new method was proposed to change the sealing uniformity of different interface patches by changing the size of the microgroove and the direction of the glue spreading.Taking the micro-assembly process of half-cavity casing film,narrow slot sealing and target ball inflation tube as an example,the adhesive bonding process was analyzed.On the basis of the above research,the experimental platform was built.Through a large number of experiments,the correctness of the simulation model and the reliability of the analysis method were proved,which met the needs of the actual project adhesive assembly.Experimental and research results show that the roughness,bonding pressure,interface contact angle,interface shape,microstructure and other parameters affect bonding quality.According to the interface parameters,reasonable selection of interface and location,microstructure and other parameters can make the glue spot nail at the junction of two interfaces,improve the uniformity and sealing of glue.