Study Of The Micro Adhesive Dispensing Technology

With the high-speed development of Micro Electronic Mechanical System and micro electronics, the size of apparatus is becoming smaller and smaller. The requirement of coupling is not easy to deal with. The technology plays an important role in micro assembly system which is compositive and complex in materials. The method of bonding mini accessory is used in micro assembly system instead of traditional screw joint structure. Because bonding technology can not destroy the surface of accessory, the stress between joint interface is average, the bonding technology has become one of the most important connect methods. The micro dispensing technology is dispensing adhesive in a controlled way which is a key technology in micro accessory bonding.After studying dispensing system in existence, a system is developed to deal with micro dispensing. It includes mechanical system and control system. Do the research with high air pressure and low air pressure. It is hard to jetting exactly when in the condition of using high air pressure and long distance between hole and glass. The shape is unacceptable when using low air pressure and short distance between hole and glass.In conclusion, by analysing non-newton characters, thixotropy character and infiltration theory, we find out that adhesive will flow along the dispensing needle. We propose a new method of dispensing adhesive. The new method overcome the disadvantage of dot is not consistent in original way. By using the method proposed in this paper, it is easy to different size of dot without changing dispensing needle. It comes true by changing the depth of dipping into adhesive and the time of dipping. The shape and consistent is also acceptable.