Design And Preration Of Micro Hemispherearrays For 3D Structure Of MEMS On Thesilicon Substrate

MEMS devices can not be manufactured without wet etching technology,Wet etching technology has low production cost and simple process.This article has done relevant research on silicon oxide,photolithography and wet etching,in particular on silicon photolithography and wet etching.Pretation of micro hemisphere arrays for 3D structure MEMS on the silicon substrate whit three-step photolithography and four-step wet etching.Designed a unique photolithography step and a wet etching experiment.Do some research of corrosion behavior on silicon in different corrosion temperatures and different corrosion times,the chamfering effect in this corrosive environment was found.The etching solution is 40%TMAH solution with the addition of0.1%Triton X-100,this etching solution in constant temperature 70 degree acting on Silicon with marked:the corrosion rate on the silicon(100)crystal orientation and silicon(110)crystal orientation is almost the same in one hour.This corrosion condition provides a good reference for the research and preparation of curved MEMS devices.