Study On The Theory Of Precise Control Of Motion Pair Property By In-Mold Micro-Assembly Molding

How to accurately predict and control the debonding characteristics of fusion adhesion for in-mold micro-assembly interface is a key scientific and technical problem for in the fabrication of high performance polymer micromechanical motion pairs using in mold micro assembly.In response to this key scientific and technological issue,Study the key science and technology,the simulation platform of debonding and peeling behavior was established for fusion bonded interface of micromechanical moving pair in In-mold micro-assembly process,the relationship among the forming process parameters,the interfacial fracture toughness parameters of debonding and peeling,and the interfacial debonding and peeling characteristics was established,the key control parameters of debonding and peeling characteristics for the moving pair interface are clarified.The evolution law of micro assembly interfacial stress relaxation during the cooling,solidifying,shrinking,self-tightening process was studied.An innovative technology of surface modified function liquid film assisted in mold micro-assembly was proposed in which the common technical problems of poor moveable performance and high rejection rate of the traditional in mold micro assembly molding can be solved effectively,and which provides a scientific theoretical basis and technical support for the industrial promotion of the micro assembly technology.Based on the micro assembly interfacial thermoviscoelastic contact theory during the cooling,solidifying,shrinking,self-tightening process and fusion adhesion debonding and peeling cohesive model,the simulation platform of debonding and peeling behavior was established for fusion bonded interface of micromechanical moving pair in In-mold micro-assembly process,The results show that the prediction error of debonding and peeling driving force for assembly interface of micromechanical moving pair is less than 5%by means of the comparative analysis between simulation and experimental test.the relationship among the forming process parameters,the interfacial fracture toughness parameters of debonding and peeling,and the interfacial debonding and peeling characteristics was established by simulation,and it is found that the interfacial debonding and peeling is controlled by the critical strain energy release rate and the crack initiation stress,and which has a positive correlation with the crack initiation stress and the critical strain energy release rate,however,the interfacial crack initiation stress and the critical strain energy release rate of the micro-assembly interface is in direct proportion to the melt injection temperature of the secondary molding.By reducing the injection temperature,the critical strain energy release rate and the interface crack initiation stress can be reduced,which is beneficial to restrain the fusion adhesion of the micro assembly interface,and improve the.movable performance of the moving pair.Simulation study constructed the vice interface debonding stripping process parameter,material fracture toughness parameters,cooling solidification interface from the tight contact characteristics,fused the adhesion interface debonding stripping features-to relevance theory,the performance of the study found that the micro assembly welding adhesive interface debonding of stripping is controlled by the interface stress and the critical strain energy release rate and crack,and interface stress and the critical strain energy release rate and crack was a positive correlation,and micro assembly the interface stress and the critical strain energy release rate and crack was positively associated with secondary molding melt injection temperature,reduce the secondary injection molding temperature,can reduce the critical strain energy release rate and interface crack stress.It is beneficial to restrain the welding adhesion of micro-assembly interface and improve the moveability of moving pair.An innovative technology of surface modified function liquid film assisted in mold micro-assembly was proposed in which the common technical problems of poor moveable performance and high rejection rate of the traditional in mold micro assembly molding can be solved effectively,and which provides a scientific theoretical basis and technical support for the industrial promotion of the micro assembly technology.