Key Technologies Of Controllable Forming For Debonding Characteristics Of Motion Pair In In-Mold Micro-Assembly Process

The bonding adhesion and driving friction resistance of micro mechanical motion pair induced by self-tightening pressure of cooling and solidification shrinkage for in mold micro assembly process are the key factors to induce the loss of motion performance of micro mechanical pair,which is key inducing factors of high rejection rate and make the technology be still at the experimental stage.How to regulate the debonding characteristics of the micro assembling interface is common key technical problems in micro assembly molding.In view of this key scientific and technological problem,the simulation platform for thermal visco-elastic plasticity shrinkage and self-tightening contact analysis is built.the key control parameters affecting the debonding characteristics of micro assembling interface are clearly defined by means of experiments and numerical simulation,The law of its influence is studied,and the mechanism of micro assembling interface debonding for micro mechanical motion pairs in micro assembly is revealed.The surface modification liquid membrane assisted innovative micro assembly molding technology with efficient debonding was put forward,which laid a scientific theoretical foundation and technical support for polymer micro mechanical micro assembly molding process.The main innovations and achievements of the paper are as follows:Based on in mold micro assembling characteristics of polymer micro mechanical motion pairs and reasonable hypothesis,A theoretical model describing the self-tightening contact characteristics of the thermal viscoelastic plastic shrinkage is established,which is based on the cooling,solidification and volume shrinkage.The simulation platform for thermal visco-elastic plasticity shrinkage and self-tightening contact analysis is built.The influence of molding process parameters and material performance parameters on the debonding characteristics of micro assembly interface is systematically simulated,the debonding mechanism of the micro assembly interface was revealed.The relationship between the debonding characteristics of micro assembly interface and key control parameters is established.Research shows that self-tightening contact characteristics of the micro assembly interface is positively related to the melt injection velocity,the injection temperature,and is negatively related to thermal conductivity and wall temperature of secondary filling melt.A kind of surface modified functional liquid is developed to improve the interface debonding characteristics of micro assembly interface.An innovative surface modification liquid assisted micro assembly molding process is developed,in which the adhesion and shrinkage pressure of the micro assembly interface can effectively reduced and eliminated,and the moving control of micro assembly interface is realized,the technical problem of high reject rate induced by the loss of its mobility was solved.The comparing analyses between the numerical simulation and the experimental results is made.The experimental results show that the simulation technology and method of the thermal viscoelastic plastic shrinkage and self-tightening contact characteristics of micro assembly interface is correct and reliable in this paper,the maximum error of simulation results and test results is not more than 10.9%.