Research On Heat Dissipation Mechanism Of Electronic Equipment Based On Micro Heat Pipe Array

At present,electronic devices are facing the problem of performance improvement,and miniaturization and integration have become the leading direction of development.The direct consequence of higher integration is the increase in the heat generation of the chip per unit area,so the heat dissipation structure and size will face severe challenge.The flat micro heat pipe is one of the more effective heat transfer devices,which provides an effective and feasible solution to the heat dissipation problem of electronic products.In order to explore the relationship between the heat transfer characteristics of the flat micro heat pipe and its structural design,understand the advantages of the micro heat pipe in heat dissipation,and provide direct and reliable experimental data for improving the performance of the micro heat pipe,this paper develops the heat dissipation of electronic equipment based on the micro heat pipe array Mechanism research.This article takes the heat dissipation of electronic equipment as the background.In the case of natural convection,the electronic equipment model is abstracted into a cavity with different types of heat sources.Pure natural convection,three heat dissipation conditions for aluminum tubes and micro heat pipes are designed,and thermocouples are used.Temperature acquisition system,and build a laser holographic interference and micro-stream smoke tracer visualization experiment platform.The test platform can realize multi-faceted detection.Based on the experimental platform,the characteristics of heat source surface temperature changes under the same type of heat source in three working conditions are tested,and the changes of relative air temperature and flow field in the cavity are discussed.It is a balanced way of heat dissipation,but with its advantages of small size and low cost,micro heat pipes are the best choice for heat dissipation of electronic equipment.According to the conclusions of the experiment,the following experimental settings have been made for the optimization of the structure of the micro heat pipe radiator.A variety of working conditions have been carried out by changing the heat sourcespacing,heat source power,relative position of the micro heat pipe and the heat source,and the longitudinal length of the micro heat pipe The heat dissipation performance of the micro heat pipe was tested,and the effect of forced convection micro heat pipe fin angle on heat dissipation was analyzed,and the heat source temperature curve was drawn.The test results show that the heat exchange effect is best when the heat source spacing is 100 mm and the heat source power is 10 W.The micro heat pipe has the highest heat dissipation efficiency on the side of the heat source.When forced convection,under the same airflow speed and heating power,compared with aluminum fins,the flat micro heat pipe(MHPAF)with fins can effectively reduce the temperature of the heat source.When the bending angle of MHPAF exceeds 135 °,the effect on the temperature of the heat source can be Ignore,under the same airflow speed and heating power,the fin type affects the heat source temperature and the average fin temperature.The average temperature of MHPAF fins is higher than that of aluminum fins,which has higher heat dissipation efficiency.Aiming at the above radiator modeling,the equivalent method of heat pipe is used for simulation and comparative experiments.From the experimental and simulation perspectives,the heat dissipation characteristics of the flat micro heat pipe are analyzed,and the influencing factors that affect the heat dissipation efficiency are analyzed to provide a theoretical basis for subsequent research.