Flip-chip Welding Design Of Silicon Carbide Nuclear Radiation Detector

In applications such as nuclear industry,aerospace,and nuclear medicine,nuclear radiation detectors must be used to monitor radiation in real time.The currently widely used nuclear radiation detectors are silicon-based detectors.In recent years,with the wide application of wide bandgap semiconductors,silicon carbide materials have received extensive attention because of their excellent radiation resistance.Therefore,research on silicon carbide-based nuclear radiation detectors has been ongoing,and the characteristics of the device have also been gradually improved to reach the application level.But for real practical application,the packaging design of the silicon carbide nuclear radiation detector is also needed.This article gives a flip-chip welding design scheme for a specific size silicon carbide nuclear radiation detector.This paper investigates the existing electrical connection methods and selects flip chip welding to electrically connect the silicon carbide nuclear radiation detector.The article elaborated on the characteristics and realization process of the flip-chip soldering process in detail.It simply realized a flip-chip soldering process.Combining the process to achieve the test results and the function of the ANSYS tool,the size distribution of solder balls,soldering materials and substrate materials were determined As the key parameter to be determined by simulation.The design uses the method of control variables to determine the size of the solder ball,the choice of solder and the substrate material in turn.In order to select the appropriate solder ball size,this article uses ANSYS tools to build four models of different solder ball sizes,apply the same heat generation load and boundary conditions to the model,and select the size of 100microns and the center according to the thermal simulation results.Solder bump structure distribution from 400 microns.In order to select the appropriate solder,the Anand model is used to sim ulate the mechanical deformation of the solder for the solder failure mode.Using ANSYS to apply cyclic thermal load to the model,based on the mechanical deformation results of the model,substitute C-M formula to calculate the reliability life of the device,and finally selected tin-lead alloy(Pb₆₃Sn₃₇)as the soldering material.In order to select the appropriate substrate material,the detector models corresponding to the three substrate materials were established respectively,to simulate the thermal distribution of the detector when it was working,and to simulate its stress distribution according to the thermal simulation results.Following the principle of minimum deformation and good thermal conductivity,combined with the radiation resistance of the material,alumina was selected as the substrate material.Through the above simulation and the analysis of the results,this paper presents the selection method and selection results of the three key parameters in the flip-chip welding design,and realizes the targeted and relatively complete flip-chip welding simulation design.