The Application Of 6 Sigma In The Solder Paste Printing Process

Due to the intensified competition and the improvement of living standards,people have higher and higher requirements for electronic products,such as light weight,small size,high density,good performance,high speed,strong functions,and so on.The continuous improvement of customer requirements has led to a corresponding increase in demand for raw materials,manufacturing processes,and finished product testing.At present,electronic manufacturing is basically based on SMT.Perhaps with the development of science and technology,chip integration will make products more lightweight,simpler,and better assembled.However,at present,smaller components,smaller substrates,More sophisticated process requirements,etc.pose a higher challenge for SMT.The soldering problem in printed circuit boards is the most troublesome issue for manufacturers in the entire electronics assembly process,and it is also one of the major factors in the increase of manufacturing costs and the low yield rate.This article analyzes and studies the problems in the actual production work of the Ninth Institute of China Aerospace Science and Technology Corporation.It was found that 60%~70% of soldering defects mainly occurred in the solder paste printing process and contained different welding defects.As soon as possible to solve the problem of welding defects in the printed circuit board process,improve production efficiency and yield rate,reduce the risk of customer complaints,so that companies obtain greater financial returns,this is the focus of this study.It is a very meaningful and difficult job to produce high-quality products,increase production efficiency,increase the efficiency of enterprises,and thus increase the competitiveness of enterprises,and at the same time complete the precipitation and inheritance of the company's own technology..This article first introduces the status quo of printed circuit boards produced by the company,the research status at home and abroad,and the difficulties the company currently faces.Then it elaborates on the process flow,identifies customer needs and key quality characteristics,and determines the implementation plan of the project.The use of Six Sigma DMAIC improvement process to expand,based on the measurement analysis,the ability to reproducibility and reproducibility of the measurement instrument analysis,and then identify the impact of the key quality characteristics,the application of experimental design DOE,to find the best combination of parameters.The application of the research results shows that after the application of Six Sigma,the SMP solder paste printing process capability Cpk increased from 1.20 to 2.26.The improved experimental data shows that the best combination of parameters greatly improves solder paste process capability.