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The WiFi Transceiver Package Quality Improvementin S Company Based On 6 Sigma

Posted on:2018-03-26Degree:MasterType:Thesis
Country:ChinaCandidate:Z G ZhangFull Text:PDF
GTID:2429330596962672Subject:Industrial engineering
Abstract/Summary:PDF Full Text Request
With the high-speed development of consumer electronics,chip module integration is higher and higher,in view of the WiFi(Wireless Fidelity,a Wireless connection)transceiver multichip module integrated circuit(WiFi chip),the performance requirements more and more high,this kind of product can realize personal computers,handheld devices such as terminal wirelessly connected to each use,main application areas including mobile phones,tablet computer,e-books,wearable mobile terminal equipment,etc.Due to this kind of chip packaging technology demand is high,the product itself complicated structure,small size,manufacturing process is not yet implemented the whole process automation,there are some manual work,percent of pass has been not ideal,in the process of production process of the other problems are also constantly bothering you and affect the product's normal shipment,and loss produced by nonconforming product is not low,not only bring a proportion of economic losses,but also because of delivery not in time,lead to customer satisfaction has also dropped,if can use the scientific method to improve,will bring great benefits and save resources.The content of this study is through six sigma method,in the company S for wi-fi chip is the high fraction defective is to improve the quality of the work.First is the company S WiFi chip production status and introduces the quality problem,through the analysis of the pareto chart wi-fi chip top defects,and then according to the unqualified problems found wi-fi chip failure mode analysis and research,to reduce the unqualified products ratio is set as primary goal,and then according to the measured results may cause the possibility of wi-fi chip is unqualified,using qualitative analysis and quantitative analysis,Using the C&E(Cause&Effect Matrix,cause and Effect matrices)and FMEA(Failure Mode and Effect Analysis,Failure Mode and effects Analysis)and TRIZ(Teoriya Resheniya Izobreatatelskikh Zadatch),determine the main influence factor,step by step again for all the possible causes of the defects,we analyze respectively,and the DOE test design,finally,the scheme for validation,to improve the Effect of tracking confirmation.This article from the perspective of six sigma quality management,customer requirements as the basic direction,from the enterprise profit and obtain competitive position action,by strengthening the product and technology innovation and Improve the quality of our products and the DMAIC(D-Define,M-Measure,A-Analyze,I-Improve,C-Control)process Control application in the encapsulation process qualification rate of quality improvement and optimization,through continuous experiment,continuously Improve product quality,at the same time of meet the quality of the quality of customer demand,make full use of existing resources to maximize the efficiency of the equipment used.By enhancing work efficiency and work quality,improve customer satisfaction.After six sigma project implementation,the WiFi chip not qualified rate reduced to 2.5% from 6.5% before improvement,according to the calculated annually to avoid losses of 3.8 million yuan as a result of nonconforming product.
Keywords/Search Tags:Six sigma, Process analysis, design of experiment, Failure Mode And Effect Analysis, Theory of the Solution of Inventive Problems
PDF Full Text Request
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