| The development of Internet + provides a huge market for smart phones.The manufacturers have continuously updated and upgraded the functions of mobile phones,shorten delivery cycle to seize the market,so manufacturers are required to increase their capabilities to ensure that products are shipped in quality and quantity.H product is motherboard for a new generation of smart phone,which produced by F company as F company is contact manufacture of H company.This motherboard has low rolling yield rate when starting mass production,which delay the product shipment and cause customer un-satisfaction.F company also spend high cost to repair or scrape the defect product.In this paper,six sigma DMAIC improvement model is applied to F company's quality management research to improve the main board yield.Through the research on the current situation of the company and customer needs,the project objectives are defined,the project plan is established.In the measurement stage,the product process capability and measurement system are studied.Through data collection and Plato analysis,it is understood that the main defects affecting the pass through rate are short circuit,open circuit and less tin.Using the potential failure mode and affect analysis,the team finds out that the main processes causing the defects are Screen printing,patch,reflow soldering.In the analysis stage,the key factors affecting the process quality are confirmed through causal matrix and hypothesis test.In the improvement stage,the key factors are optimized through experimental design.In the control stage,confirm the improvement effect and control the improvement measures.Through the successful implementation of DMAIC improvement model,the yield has been increased from 88% to 97.5%,saving 1 million RMB annually for F Company.Customer's satisfaction improved.The project's success also enhanced the competitiveness of enterprises,and provide a good reference for the quality improvement of industry. |
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