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Electroless copper plating on graphite/epoxy and graphite/cyanate ester laminates

Posted on:1999-06-04Degree:M.SType:Thesis
University:San Jose State UniversityCandidate:Xu, HongFull Text:PDF
GTID:2461390014470098Subject:Engineering
Abstract/Summary:
This thesis addresses the effects of surface preparation conditions on electroless copper plating of graphite/epoxy and graphite/cyanate ester liminates. An alkaline permanganate etchant was applied to the substrates by three methods: immersion, ultrasonic immersion and spray etching. Three etching parameters were investigated: permanganate concentration, etching temperature and etching time. A High Power Microscope was used to characterize the surface topography of the etched and plated laminates.; Results showed that permanganate concentration and etching time were two major factors in etching. Immersion, ultrasonic immersion and spray etching methods resulted in different surface topography. Some of the laminates plated in the electroless copper deposition bath for 1 minute could pass tape test. While at copper deposition time of 15 minutes, the adhesion of tape test classification 3 was achieved on untoughened graphite/cyanate ester laminates. Poor plating could be explained by insufficient surface roughness.
Keywords/Search Tags:Graphite/cyanate ester, Electroless copper, Plating, Laminates, Surface
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