Copper Clad Laminates Based On Modified Cyanate Resin With High Temperature Resistantance

With the rapid development of electronic industry,copper-clad plate as the key basic material,the performance of high and low performance is good or bad will directly affect the electronic products.The requirements of high-end electronic products is low dielectric constant,low dielectric loss as well as excellent resistance to high temperature performance.Ordinary plate copper-clad already cannot satisfy the market demand,so we need to develop a higher comprehensive properties of copper clad.Cyanate ester resin(CE)is a high performance thermosetting resin,very suitable to serve as the matrix resin of high frequency copper-clad boards.However of cyanate ester resin after curing still has its limitations,crosslink density is big,curing the characteristics of big brittleness limits its wide application.Therefore,this paper chooses a good dielectric properties and good hydrophobic thermoplastic resin polyphenylene oxide(PPO)on the modification,and improve the comprehensive performance.This article adopts the way of blending modification to improve performance of polyphenylene ether resin.With polyphenylene ether(PPO630)with bisphenol A type(CEO1PO)blend modified cyanate ester resin,preparation for PPO/CE resin;Using A modified polyphenyl ether(SA90)with bisphenol A type(CEO1PO)blend modified cyanate ester resin,preparation of SA90 / CE matrix resin.Tracking determination of two kinds of resin system viscosity-temperature dependence and gelation time temperature dependence.In addition,respectively by PPO/CE system and SA90 / CE system as the matrix resin,inorganic glass cloth as reinforcing material,the preparation of the copper-clad boards,and their mechanical properties,dielectric properties,electrical insulating properties,water absorption and solder resistance was tested.As temperatures rise,PPO/CE resin system with SA90 / CE resin system are gradually reduce viscosity and gelation time.The apparent activation energy of PPO/CE resin system between 55-70 kj/mol,SA90 / CE resin system of the apparent activation energy between 40-50 k J/mol.With CE resin in share of PPO/CE resin system increases,the obtained copper clad with the reduce of resistance to bending strength,with the increase of copper foil peel strength,dielectric constant and dielectric loss factor increase,volume resistivity increase,bibulous rate is improved,high temperature resistant welding performance is not strong.Cyanate ester resin and PPO when mass ratio of 1:1 about resin system,the best comprehensive properties of PPO/CE copper clad laminates.As SA90 resin in the resin system,as a proportion of the copper clad with the increase of copper foil peel strength,resistance to bending and tensile strength decreases,dielectric constant and dielectric loss factor is less,volume resistivity changed little,bibulous rate is a little change,soldering resistance is increased.When SA90 PPO630 resin around the mass ratio of 1:1 of resin system,SA90 / CE copper clad comprehensive performance is best.This article adopts the way of blending modification to improve performance of polyphenylene ether resin.With polyphenylene ether(PPO630)with bisphenol A type(CEO1PO)blend modified cyanate ester resin,preparation for PPO/CE resin;Using A modified polyphenyl ether(SA90)with bisphenol A type(CEO1PO)blend modified cyanate ester resin,preparation of SA90/CE matrix resin.Tracking determination of two kinds of resin system viscosity-temperature dependence and gelation time temperature dependence.In addition,respectively by PPO/CE system and SA90/CE system as the matrix resin,inorganic glass cloth as reinforcing material,the preparation of the copper-clad boards,and their mechanical properties,dielectric properties,electrical insulating properties,water absorption and solder resistance was tested.As temperatures rise,PPO/CE resin system with SA90 / CE resin system are gradually reduce viscosity and gelation time.The apparent activation energy of PPO/CE resin system between 55-70 kj/mol,SA90/CE resin system of the apparent activationenergy between 40-50 kJ/mol.With CE resin in share of PPO/CE resin system increases,the obtained copper clad with the reduce of resistance to bending strength,with the increase of copper foil peel strength,dielectric constant and dielectric loss factor increase,volume resistivity increase,bibulous rate is improved,high temperature resistant welding performance is not strong.Cyanate ester resin and PPO when mass ratio of 1:1 about resin system,the best comprehensive properties of PPO/CE copper clad laminates.As SA90 resin in the resin system,as a proportion of the copper clad with the increase of copper foil peel strength,resistance to bending and tensile strength decreases,dielectric constant and dielectric loss factor is less,volume resistivity changed little,bibulous rate is a little change,soldering resistance is increased.When SA90 PPO630 resin around the mass ratio of 1:1 of resin system,SA90 / CE copper clad comprehensive performance is best.In add catalyst DBDTL SA90/CE resin system and the preparation of copper-clad laminate composite material,found that with the improvement of catalyst DBDTL content,the mechanical properties of copper clad changed little,dielectric constant and dielectric loss factor is less,bibulous rate decreases.When adding catalyst and mass ratio reaches around 1:20 of CE resin,was prepared by copper clad comprehensive performance is more outstanding.In add catalyst DBDTL SA90/CE resin system and the preparation of copper-clad laminate composite material,found that with the increase of content of crosslinking agent TAIC,the mechanical properties of copper clad increases,dielectric constant and dielectric loss factor increase,bibulous rate is a little change,soldering resistance significantly enhanced.When adding crosslinking agent is about3% mass fraction in,the comprehensive performance of copper clad is more outstanding.