| The optimization of thermo-mechanical properties of polymer composites at low filler loadings is of great interest in both engineering and scientific fields. There have been several studies on high aspect ratio fillers as novel reinforcement phase for polymeric materials. However, facile synthesis method of high aspect ratio nanofillers is limited. In this study, a scalable synthesis method of high aspect ratio silica nanofibers is going to be presented. I will also demonstrate that the inclusion of high aspect ratio silica nanofibers in epoxy results in a significant improvement of epoxy thermo-mechanical properties at low filler loadings. With silica nanofiber concentration of 2.8% by volume, the Young's modulus, ultimate tensile strength and fracture toughness of epoxy increased ~23, ~28 and ~50%, respectively, compared to unfilled epoxy. At silica nanofiber volume concentration of 8.77%, the thermal expansion coefficient decreased by ∼40% and the thermal conductivity was improved by ∼95% at room temperature. In the current study, the influence of nano-sized silica filler aspect ratio on mechanical and thermal behavior of epoxy nanocomposites were studied by comparing silica nanofibers to spherical silica nanoparticles (with aspect ratio of one) at various filler loadings. The significant reinforcement of composite stiffness is attributed to the variation of the local stress state in epoxy due to the high aspect ratio of the silica nanofiber and the introduction of a tremendous amount of interfacial area between the nanofillers and the epoxy matrix. The fracture mechanisms of silica nanofiber filled epoxy were also investigated. The existence of high aspect ratio silica nanofiber promotes fracture energy dissipation by crack deflection, crack pinning as well as debonding with fiber pull-out leading to enhanced fracture toughness. High aspect ratio fillers also provide significant reduction of photon scattering due to formation of a continuous fiber network within the composite. The resulting silica nanofiber filled epoxy would be widely applicable as underfill and encapsulant in advanced electronic packaging industry because of its electrically insulating, low cost and ease of processability. |
