Research On Development Tendency Of Sn-Bi Lead-free Solder Based On Patent Analysis

Technology development is an important way to enhance competitiveness.In the process of technology research and development,it is necessary to accurately judge the trend of technology development,so as to find the direction of technology research and development,shorten the research and development cycle and reduce the cost of research and development.Therefore,the analysis and acquisition method of scientific and technological development trend is particularly important.Sn-Bi lead-free solder plays an important role in lead-free welding process with various advantages.The wave of lead-free soldering has been promoted for several years,but there are still some problems to be solved.Therefore,it is necessary to analyze the development trend of tin bismuth lead-free solder technology,so as to help the development of technology research and development.This paper mainly studies the following contents:(1)In order to build a scientific and reasonable technology development trend analysis model,several basic theories,such as patent analysis,TRIZ(invention problemsolving theory)theory and logistic growth model,which can be used for trend analysis and prediction,are studied,and the feasibility of organically combining several methods for technology development trend analysis is discussed.(2)Based on the above theories,this paper constructs a technology development trend analysis model based on patent data,patent analysis,TRIZ theory and logistic model.The model is mainly composed of five parts,including technology deconstruction module,patent retrieval module,macro analysis module,clustering analysis module and technology development trend analysis module.According to the process,the accurate technology development trend is gradually obtained.(3)The development trend of Sn-Bi lead-free solder technology is analyzed according to the above model,and the validity of the model is verified by the process.In the analysis process,firstly,the technology of Sn-Bi lead-free solder is understood from many levels,and according to IFR's final ideal solution,the performance requirements of Sn BI system lead-free solder are described comprehensively from two aspects of useful performance and harmful performance.Secondly,on the basis of patent retrieval,the macro situation of the technology related patents is analyzed.Then,in the process of clustering analysis,the relevant performance requirements in the patent text and the results of technical deconstruction are integrated.Combined with expert opinions,the performance requirements of Sn-Bi lead-free solder are expanded as clustering standards and performance sub elements.At the same time,according to the internal logical relationship,these sub elements form two clustering themes,weldability and reliability,and cluster analysis.Finally,based on the data of the total patent applications and the total patent applications under the two clustering themes,the technology life cycle analysis is carried out respectively.Based on the results of the overall life cycle analysis in the field of technology,and the results of solderability and reliability analysis as supplement and confirmation,through comprehensive judgment,it is finally determined that the technology of Sn-Bi lead-free solder is in the mature stage,and there is still a lot of room for improvement.At the same time,combined with the law of technological evolution,four possible technological development routes in the future are tentatively given.