Research On Embedded Grinding Active Measurement And Key Technology

Grinding is an important process of high-precision parts.The quality of grinding directly affects the performance and quality of parts.Therefore,it is necessary to study the grinding process,measuring instruments and technical methods.At present,the active measurement technology has replaced the off-line measurement method in grinding,and the efficiency and accuracy of grinding are improved.The active measurement of grinding is a measuring instrument which can monitor the change of workpiece size and control the grinding process in the active measurement of grinding.Aiming at the problems of digital tube display,non intuitive interface,low precision and high cost of current active measuring instruments,an embedded grinding active measurement is proposed,and its key technology is studied.The main research contents and achievements are as follows:(1)The overall design scheme of active measurement is proposed.Starting from the principle of active measurement and the functional requirements of active measurement,the technical requirements of the active measurement are determined.Combined with the position and function of the controller in the whole grinding active measurement system,the overall design scheme of the active measurement is determined.(2)Complete the hardware selection design and software platform development.In terms of hardware selection,the core board and expansion board are designed,the main modules such as main control device,analog-to-digital conversion,CPLD extension and esp8266 are developed,the I/O requirements are designed and analyzed.In the aspect of software development,the ?C/OS-III embedded operating system is transplanted to the measurement,the interaction interface is designed,and the design scheme of the system and specific program is given.At the same time,the development of upper computer software and the design of data management scheme based on Lab VIEW are completed.(3)The data processing techniques such as filtering method,intermittent surface treatment and grinding process parameter optimization are studied.Various filtering methods are studied,and the filtering processing method of combining limiting and moving average filtering is adopted.A discontinuous surface treatment model based on support vector machine is proposed.The recognition and fitting prediction function of the model is used to realize the discontinuous surface treatment.Based on the grey target decision theory,the optimization analysis of process parameters is carried out to obtain the better combination of grinding parameters and guide the setting of process parameters.(4)An improved wavelet time series model is proposed to study the size prediction theory and technology of embedded active measurement.Aiming at the deficiency of traditional threshold function,an improved wavelet threshold function is proposed,and a combined model of wavelet time series analysis is constructed.Through the prediction model,the trend of size can be predicted,and the machining information can be fed back in time.Finally,the accuracy and feasibility of the improved wavelet time series model are verified.(5)The experiment and analysis of embedded grinding active measurement and key technology.The performance and function of the active measurement and upper computer software are verified by experiments.The effectiveness of data processing techniques such as filtering method,discontinuous surface treatment model based on support vector machine,grinding process parameter optimization analysis based on grey target decision are proved.The accuracy and reliability of the improved wavelet time series size prediction model are analyzed,the automation degree of grinding active measuring instrument is improved.