Research On Preparation Process Of Micro Precision Diamond Tools And Key Technology

With the increasing demand for micro-precision parts in the fields of aerospace,medical equipment,precision instruments,etc.,micro-machining methods have attracted the attention of researchers.The surface produced by micro grinding has better quality and higher efficiency,so it has an important position in the field of micro-machining.In addition to the research on micromachining technology,the research on micromachining tool preparation is also very important.This article analyzes the characteristics of the traditional micro tool preparation process,proposes a new diamond tool preparation method,and studies the material removal mechanism in depth,and finally applies it to the micro-drill grinding process of hard and brittle materials.First,based on the summary analysis of the existing micro tool machining methods,a new micro tool machining method called controlled inclined grinding is proposed.This method is mainly to add an inclination between the substrate workpiece and the grinding wheel to improve micro tool's accuracy.In addition,based on in-depth study of external cylindrical grinding and surface grinding theory,a material removal mechanism model of the controlled inclined grinding method was established,including the undeformed chip thickness model and surface roughness model,and the corresponding relationships were established according to the geometric relationship.Expression.The influence of factors such as inclination,machining position and grinding method on the machining results of the substrate was investigated by designing a single factor experiment.In addition,it was compared with the traditional cylindrical grinding method,and many diameters ranging from 8 ?m to substrates between 120?m and aspect ratio greater than 50.After analyzing the experimental data,the optimal inclination angle was finally obtained as 0.5°,and the relational expression between the inclination angle of the experimental platform constructed and the deviation of the processed substrate was fitted,and the best combination method of substrate processing was obtained by up grinding&position "a".In addition,the conclusion is obtained that the external grinding method has a large impact and is not stable,and the controlled inclined grinding method has a smooth processing and a smooth surface.Secondly,through a large number of abrasive coating experiments,the best electroplating parameters at the 200 ?m scale were finally obtained:the pre-plating current density was 1 A/dm3,the plating time was 5 minutes,the current density of the sanding was 1 A/dm3,and the plating time was 26 minutes The thickened current density is 1.5A/dm3,and the plating time is 24min.Finally,it is proposed to use coating glue to treat the surface of single crystal silicon workpieces to improve the quality of single crystal silicon micro-drilling and grinding.The mechanism of this improved method is also described.The micro-drilling and grinding is designed by designing single factor experiments.Finally,through statistical analysis of the experimental data,it was concluded that the coating glue can effectively suppress the chipping of hard and brittle materials,and the chipping size decreases with the increase of the rotation speed and decreases with the decrease of the feed rate.The conclusions obtained in this study provide a theoretical reference and experimental basis for micro tool preparation and microgrinding and drilling technology for hard and brittle materials.