| Oxetane can be used as a monomer to participate in the reaction,and can also be used as a reactive diluent in the UV curing system.Oxetane has the characteristics of low curing shrinkage,low toxicity,and good adhesion.Organic silicon materials have obvious advantages in terms of electrical insulation,high and low temperature resistance,and thermal stability.Combining oxetane and organosilicon materials,the two materials complement each other in performance,and the obtained light-curing resin has some excellent prope rties.In this paper,a silicon-containing oxetane was synthesized and its performance was explored.The specific research contents are as follows:First,under alkaline conditions,the optimal synthesis conditions were selected by comparison.The molar ratio of 3-ethyl-3-propenyloxetane to allyl bromide was 1.0:1.2,and the reaction time was 24 h.Infrared spectroscopy and hydrogen nuclear magnetic resonance spectroscopy showed that the product was 3-ethyl-3-propenyloxetane.Secondly,in an environment where toluene is the solvent,3-ethyl-3-propenyloxetane and diphenylsilane are used as raw materials,and tris(triphenylphosphine)rhodium chloride is used as a catalyst to synthesize the product.The product characterized by Fourier infrared spectroscopy,hydrogen nuclear magnetic resonance spectroscopy and carbon nuclear magnetic resonance spectroscopy is the target product bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane.The optimal reaction conditions were explored during the synthesis process: the molar ratio of 3-ethyl-3-propenyloxetane to diphenylsilane was 2.6:1.0,and the amount of catalyst was 1 of the total mass of the reactants.%,the reaction temperature is 90°C.Then,bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane and triarylsulfoni um hexafluoroantimonate(UVI-6976)were mixed and cured.Through Fourier i nfrared spectrogram characterization,it was determined that the curing reaction of the monomer was obtained by ring-opening polymerization of the four-mem bered ring in the monomer.The mechanical properties,thermal properties and l ight transmission properties of the cured film of the monomer were tested.Ex periments show that the cured film has good mechanical properties and good t hermal stability.It always maintains a light transmittance above 95% in the ra nge of light wavelength from 350 nm to 800 nm.Through the photo-DSC test,compared with the traditional pure cationic photosensitive resin E-51,it is con cluded that bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane has excellent ph otosensitivity.Finally,bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane and epoxy acrylate JZ-101 are mixed in a ratio of 1:1 to prepare a hybrid system photosensitive resin After curing,the mechanical properties of the cured film of the hybrid system photosensitive resin are tested,and the impact strength of the cured film of the hybrid system photosensitive resin is 42kg/cm,the flexibility is 1.5mm,and the damping time is 199 s.The cured material is a brittle material,and the elongation at break is relatively Low,the maximum tensile stress of the tensile spline is 6.0 MPa,the elastic modulus is 30.0MPa,the maximum bending stress of the curved spline is 10.3 MPa,and the elastic modulus is 148.1 MPa.Mix bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane and epoxy resin E-51 at a ratio of 1:1 and add an appropriate amount of photoinitiator for curing and Analysis of its mechanical properties shows that the impact strength of the cured film is 30g/cm,the flexibility is 3mm,the damping time is 226 s,the maximum tensile force of the tensile spline is 1502.0N,and the maximum tensile stress is93.9MPa,The tensile strain is 3.7%,the elastic modulus is 19242.0MPa,the displacement at break is 2.9mm,the maximum force of the bending spline is 260.5N,the maximum bending stress is 73.2MPa,the elastic modulus is 2094.1MPa,and the flexural displacement It is 2.2mm and the bending strain is 5.7%. |
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