Preparation And MD Simulation Of Silico-containing Epoxy Resin Nanocomposites

Epoxy resin composite materials are widely used in various fields,and they are gradually showing their heads in the increasingly demanding electronic packaging materials.In the face of higher requirements of epoxy resin insulating materials,the modification of epoxy resin has become more recent Research hotspots of the year.Therefore,this thesis studies this from two aspects:molecular dynamics(MD)simulation and experimental operation.In the simulation part of this article,first,select E51 type epoxy resin,polyetheramine D230 as the curing agent,and use phenyl epoxy POSS(EP-Ph-POSS)as the modified substance to prepare POSS with a content of 2%,5%,10%,15%epoxy resin composite system,at the same time a POSS physical doping modified epoxy resin system(E51/NH₂-Ph-POSS system)and a coupling agent modified E51/KH550+PTES system are constructed(Aminopropyltriethoxysilane+pheny-ltriethoxysilane)and E51/KH560+PTES(oxypropyltrimethoxysilane+phenyltriethox-ysilane)system.Studies have found that resin materials modified by chemical bonding have better thermal properties.At the same time,it is found that in the research system of this paper,when the POSS blending ratio is 10%,there is the best thermal performance.And the thermal expansion coefficient of the material is proportional to the change of the C-O bond length in the system;the cohesive energy density and solubility parameters of the system indicate that the incorporation of POSS effectively enhances the van der Waals and Coulomb forces in the resin system,and with Both effects of increasing POSS content are weakened slightly;the bulk modulus of the epoxy resin modified by chemical bonding is lower,that is,the less compressible.Molecular dynamics simulation determined the doping ratio of Si to be 10%for subsequent experimental operations.In the experimental part,on the basis of the traditional one-step hydrolysis method to prepare POSS,the laboratory self-made oligophenyl POSS was used as the raw material,and the bifunctional POSS was prepared by the two-step hydrolysis method.Phenyl epoxy POSS can be prepared only when the agent mass ratio is 5:1.Subsequent analysis of the hydrophobic properties of the composite material was carried out.The hydrophobicity increased with the increase of the POSS blending amount,and reached a maximum of 122°,which was an increase of 17%compared with the pure resin material.Finally,the thermal performance of the composite material is researched and found that the initial thermal decomposition temperature of the POSS modified material can reach up to 347?,and the residual amount of 700?also increases with the increase of the POSS content,and the maximum increase is 18.96%.The agent does not have this special rigid structure,so the impact on epoxy resin is only the filling effect of ordinary nanomaterials,so the thermal degradation performance of the material can only be improved to a small extent.When the Si content is the same,the POSS modified The initial thermal decomposition temperature of the composite material is higher.The above research provides new ideas and methods for the development of electronic packaging materials.