Sensor Embedded Intelligent Laminate Material Packaging Structure Design And Ultrasonic Consolidation Process Research

Ultrasonic additive manufacturing(UAM)is a layered composite/computer numerical control manufacturing process.The lower molding temperature and unique molding principle make ultrasonic additive manufacturing technology an excellent technical means for manufacturing intelligent packaging metal structures,with good application prospects.In the packaging research of electronic components,two-dimensional functional packaging is the mainstream of the current research direction.However,the two-dimensional packaging form is more dependent on the circuit itself,and it is difficult to obtain the functionality brought by the three-dimensional structure;and a more compact electronic design Requirements are also more reliant on the three-dimensional structure to provide design convenience in structure.Starting from the three-dimensional functional structure,this paper proposes a package structure design idea and process plan that can enhance the induction sensitivity.The structural design is completed by finite element simulation and theoretical calculation methods,and the combination quality and structural functionality are verified by experiments.The specific research contents are as follows:(1)Using LSDYNA penetration simulation,the projectile velocity attenuation degree of10 groups of ti-al3ti laminated composites with different toughness Ti layer volume fraction is analyzed.The Ti-Al₃Ti laminated composites with 40%Ti layer volume fraction as the best anti-ballistic performance are obtained,and the packaging matrix design is completed.(2)In this paper,a piezoresistive strain sensor with model BF120-3AA150 is selected as the packaging object element.Based on the test characteristics of the sensor,a packaging scheme based on ultrasonic additive manufacturing technology and metal-based laminated composite materials is proposed.The cavity enhances the characteristics of vibration and improves the sensing sensitivity of the piezoresistive sensor.Combined with Ansys Model finite element simulation and thin plate vibration theory,the structure of the vibrating membrane is designed,and the mode shape,shape,material and size of the membrane are determined by the method of fixed variables:the material is pure copper,and the size is 20×0.1(mm)circular vibrating film,the results of simulation analysis and theoretical calculation show that the film of this specification has the best vibration response capability;complete the design of the encapsulated structural components,and draw the component engineering drawings and structural schematic diagrams.(3)According to the results of the package structure design,the ultrasonic consolidation process was studied,and a low-temperature,low-power ultrasonic dissimilar metal consolidation process was obtained;the orthogonal experiment was carried out with the consolidation degree(LWD)and welding power as the experimental results On the basis of the above experimental results,the response optimization experiment of the decreasing welding pressure was carried out;the microscopic characterization analysis of the consolidation interface of the process sample was carried out,and the analysis results showed that the consolidation process can ensure a low degree of material damage on the premise,good interfacial bonding quality was obtained.The consolidation process is as follows:the welding pressure is 528.75 N,the amplitude is 23.6?m,and the welding speed is 10 mm/s(4)According to the results of the package design and the ultrasonic consolidation process experiment,the preparation and molding of the package structure samples were completed.The DSO2C10 oscilloscope is used to extract the signal of the sensor,and the signal of the sample with different load levels is read and analyzed.The analysis results show that the sample has the ability to feedback loads of different sizes;Ansys LSDYNA finite element simulation is used to simulate the structure of the sample.The impact simulation of the conventional slotted structure is carried out.By comparing the simulation results,it is concluded that the sensitivity of the sample structure is 330%higher than that of the conventional slotted structure.