| With the development of wireless communication systems,the demand for higher-speed and larger-capacity is gradually increasing.Because of large bandwidth capacity and shorter wavelength,the millimeter wave frequency band can meet the needs of high-speed communications and the next generation of electronic systems with high integration has aroused widespread concern.At present,antenna-in-package for millimeter wave 5G and WLAN/WPAN applications are widely used in high-performance communication systems.This article designs millimeter wave antenna-in-package based on advanced packaging technology for different communication scenarios.The specific content is as follows:First,this paper designs a three-dimensional active integrated millimeter-wave broadband antenna array based on flip-chip interconnect technology.The antenna adopts a semi-elliptic slot structure fed by a coplanar waveguide,which is easy to integrate the chip,and the impedance change between different frequencies is reduced through the tapered slot structure to achieve a broadband effect.A 1×4 array design is realized on the basis of the unit,which achieves a good millimeter-wave bidirectional radiation effect.The test results show that the relative bandwidth of the array exceeds 46.2%,and the maximum gain reaches 13.1 dBi.The array and the MEMS packaged amplifier chip are interconnected through flip-chip technology to realize an active integrated antenna system.Two broadband compensation structures are designed for the parasitic effects of BGA solder balls in the system.Grounded coplanar waveguide and coplanar are realized respectively.The low-loss broadband transition effect from the waveguide transmission line to the chip,and the multi-physical field characteristics of the MEMS packaged active system under different ambient temperatures are simulated.The test shows that the relative bandwidth of the active integrated antenna array exceeds 31.5%,and the maximum active gain in the frequency band reaches 34.2 dBi.The millimeter wave three-dimensional integrated antenna-in-package has the advantages of broadband,high gain,and miniaturization,and can be used in high-speed,large-capacity communication systems in narrow,long,and straight scenarios such as bridges,tunnels,and railways.Then,for the 5G application in the 24.25-27.5 GHz frequency band,a high isolation dual-polarized microstrip antenna based on the LTCC process is designed.The antenna adopts slot coupling feeding,which reduces the cross-polarization level;an air cavity is opened between the patch and the ground plate,which improves the antenna gain by reducing the equivalent dielectric constant of the dielectric plate;the upper layer of the patch is added with a dielectric With the air cavity,the antenna return loss is improved;isolation metal vias are added around the stripline signal line to avoid signal interference between the two polarizations,and at the same time help package heat dissipation.The antenna unit achieves a relative bandwidth of 12.7%,the gain reaches 6.2 dBi,the isolation between the two polarizations is greater than 28 dB,and the cross polarization level is less than-28 dB.It has the advantages of high isolation and miniaturization,and can be used for high speed and small size millimeter wave mobile communication system.In addition,a 1×4 dual-polarized antenna array is designed on the basis of the unit,the relative bandwidth of the array is 14.4%,and the maximum gain is 10.8 dBi;finally,for the coupling between the units in the multi-channel system,the single-polarization mode is designed The high-impedance multi-stage SIR decoupling structure reduces the coupling between units by up to 17 dB in the working frequency band,achieving a good decoupling effect. |
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