| In this study,zirconium silicate(Zr Si O4)films were successfully prepared on the monocrystalline silicon substrates and Si C substrates via using non hydrolytic sol-gel method combining dip coating process using zirconium n-propanol as zirconium source,tetraethyl orthosilicate as silicon source,lithium fluoride as mineralizer,n-propanol as solvent and anhydrous citric acid(ACA)as cosolvent.The effect of process parameters such as prepareation of sol,dip-coating,drying temperature and heat-treatment on the synthesis of Zr Si O4 and the quality of Zr Si O4film were investigated by differential thermal analysis and thermogravimetry(DTA-TG),X-ray diffraction(XRD),Fourier transform infrared spectromemter(FTIR),Field emission scaning electron microscopy(FE-SEM)and Atomic force microscope(AFM),respectively.Additionally,the alkali corrosion resistance of Zr Si O4 films covered on the surface of monocrystalline silicon substrates,the thermal shock resistance and high temperature oxidation resistance of Zr Si O4films covered on the Si C substrate were also investigated.The results showed that adding appropriate amount of ACA could effectively promote the dissolution of Li F and facilitated the full contact reaction between silicon source and zirconium source,which was contributed to the preparation of pure phase Zr Si O4.When the molar ratio of ACA to zirconium n-propanol was 1.1,the concentration of the precursor was 0.1 mol/L and the aging time of sol was 24 h,the stable sol suitable for the coating could be obtained.Then,dip coating process on the single crystal silicon at 1 mm/s of lifting rate were proceeded and coating for one time.Finally,uniform and dense Zr Si O4 films were obtained when the dry temperature was40℃for 2 hours and heat treatment at 1000℃for 1 hour(the heat rate from room temperature to 500℃was 1℃/min)The monocrystalline silicon coated with Zr Si O4 film was soaked in 40%Na OH solution for 42 h at 40℃.Only a small pit corrosion was found on the film surface and the mass changed a little with the corrosion time.The mass loss of monocrystalline silicon coated with film was only0.17%.It showed that the Zr Si O4 film had excellent alkali corrosion resistance.It was more difficult for coating on polycrystal Si C substrate compared to silicon wafer,because of Si C substrate has rough surface and many holes.The optimized preparation process of sol and dip-coating process were realized by orthogonal experiment and single factor experiment on the basis of the surface coating process of silicon wafer,and the fine Zr Si O4 film could be prepared on the surface of Si C substrate via adding the surfactant of Tetra Butyl Ammonium Bromide(TBAB)and increasing the times of coating.The quality of the film could be improved effectively and crack-free Zr Si O4 film with a thickness of about 500 nm could be obtained when the molar ratio of ACA to zirconium n-propanol was 1.1,the precursor concentration was 0.1 mol/L,aging time was 24 h,the coating times was 5 and the amount of TBAB was 7 wt.%.The Zr Si O4 film had better thermal shock resistance when the Si C substrate uncoated of film occurd fracture carry on quenching from 1000℃to room temperature while Si C substrate coated of film occurd fracture in carry on quenching from 1200℃to room temperature.The weight increment of the average unit area of Si C with coated Zr Si O4 film at 1450℃for 60 h was only 2.2283×10-4 g/cm2,but that of the uncoated Zr Si O4 film was 7.2357×10-4g/cm2,indicating that the Zr Si O4 film has excellent oxidation resistance at high temperature. |