| In recent years,with the rapid development of LEO satellite constellations,active phased arrays are gradually applied to satellite communication systems on a large scale because of their fast beam scanning speed,multi-beam forming and high reliability.As the core part of active phased array,RF receive modules plays an indispensable role in the performance of phased array.In order to realize the space application of millimeterwave active phased array antenna,more stringent requirements are put forward for the receive module,such as high performance,high integration and high reliability.At present,the space transceiver module is mostly used in Ka or below frequency bands.In order to respond to the development trend of the next generation of space phased array antenna towards higher frequency bands,this paper studies the EHF frequency band receive module,and designs a tile receive module in EHF-band,which has the characteristics of low profile,high integration and easy expansion.First of all,the development of T/R module is summarized by investigating the domestic and foreign related literature in recent years.This paper introduces the relevant theoretical knowledge of the receiving assembly and the processing technology involved in the design process,compares the two integration methods of brick/tile of the receiving assembly,explains the two processing technologies of PCB multilayer board and LTCC technology,and analyzes their characteristics.The tile structure using PCB multilayer board is selected to realize high integration and low cost design.Then,according to the requirements of satellite application,the research index of the receiving module is defined,the single channel and the whole link are analyzed and designed,and the gain,noise figure and 1 d B compressed output power of the link are analyzed and simulated by ADS software.In order to realize the wiring design of fourchannel structure in the space of 16mm×16mm,and compare the isolation performance between various transmission lines,the co-planar waveguide(CPW)is determined as the transmission line form.In order to make full use of the wiring area of the upper and lower surfaces of the multilayer board,a vertical transition structure from the top transmission line to the bottom transmission line is designed,and the traditional coaxial structure is innovated to reduce the electromagnetic leakage of the structure.The design results show that the return loss of the structure is below-20 d B in 40～50GHz.In order to counteract the inductance effect caused by gold wire bonding,the transmission line is optimized.The optimized gold wire bonding structure has a return loss of less than-20 d B and an insertion loss of less than 0.3d B in 40～50GHz.In order to make the signal enter the multilayer board transmission line from the waveguide port,a vertical conversion structure from waveguide to co-planar waveguide transmission line is designed,which is similar to the traditional transition structure from waveguide to microstrip probe.The structure is easy to integrate.The simulation results show that the return loss of the structure is less than-25 d B and the insertion loss is less than 0.3d B in the frequency band of 43～46GHz,showing good transmission performance,and the structure is tested and verified.After the design of active link and the optimization of passive structure,the fieldcircuit joint simulation of the whole module is carried out.PCB multilayer board,front and back cavities and cover plates are processed and assembled.The overall size of the final assembly is 16mm×16mm×5mm,and the performance of the physical object is tested.After testing,in the range of 43～46GHz,the gain of the receiving module is about 35 d B,the noise figure is about 4.2d B,the attenuation accuracy is better than0.5d B,and the phase shift accuracy is better than 5.The measured performance is in good agreement with the simulation performance. |
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